News Article
Edge inspection tool selection will assist in wafer edge process control
Rudolph Technologies has announced that it has provided an edge inspection tool to lithography system provider ASML Holding NV (ASML) to help characterize wafer defects originating from process control issues at the wafer edge and accentuated by the immersion lithography process.
Rudolph Technologies has announced that it has provided an edge inspection tool to lithography system provider ASML Holding NV (ASML) to help characterize wafer defects originating from process control issues at the wafer edge and accentuated by the immersion lithography process.
The Rudolph tool will be used to maximise immersion lithography productivity. The work to characterise the defects of interest will be done at ASML's headquarters in Veldhoven, The Netherlands, and will utilise Rudolph's All-surface Inspection System, including the E25 edge, the AXi topside, and the B20 backside wafer inspection stations.
The Rudolph tool will be used to maximise immersion lithography productivity. The work to characterise the defects of interest will be done at ASML's headquarters in Veldhoven, The Netherlands, and will utilise Rudolph's All-surface Inspection System, including the E25 edge, the AXi topside, and the B20 backside wafer inspection stations.
