Broadcom Leaps Ahead of the Competition with the World's First '3G Phone on a Chip' Solution
Broadcom Corporation , have announced a new single-chip HSPA (high-speed packet access) processor that integrates all of the key 3G (third generation) cellular and mobile technologies on an extremely low power, single 65 nanometer CMOS die. Broadcom's new ‘3G Phone on a Chip’ solution enables manufacturers to build next generation 3G HSUPA phones with breakthrough features, sleek form factors and very long battery life, all at a fraction of the cost of today's solutions, driving widespread consumer adoption. Never before has anyone integrated as many radio devices on a single chip, which demonstrates Broadcom's technology leadership in multi-modal CMOS RF technology.
Advancements in mobile phone designs, such as the proliferation of extensive Internet applications and web services, multimedia, high resolution video and still cameras, games and music, are driving a growing demand for faster cellular networks and an appetite for rich multimedia phones that can take advantage of them. HSUPA is often considered the ultimate cellular modem technology.
There are already over 900 million subscribers in HSPA enabled networks today, and many network operators are planning massive worldwide deployment of HSUPA over the next several years. Using phones enabled by the new Broadcom(R) HSUPA processor, consumers will be able to download content at up to 7.2 Megabits per second (Mbps), and upload content such as pictures and videos at up to 5.8Mbps, all directly from their phone. HSUPA technology also holds the promise for much higher quality ‘live’ video conferencing and an array of exciting services and applications.
