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Nextreme announces breakthrough in flip chip semiconductor process technology

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Nextreme has integrated cooling and power generation into the widely accepted copper pillar bumping process used in high-volume electronic packaging.

Nextreme has integrated cooling and power generation into the widely accepted copper pillar bumping process used in high-volume electronic packaging. This breakthrough in flip chip process technology addresses two of the most serious issues in electronics today, thermal and power management constraints.

Nextreme’s approach uses proven, fully scalable technology to deliver new, enabling functionality in flip chip applications.
Potential flip chip applications for Nextreme's thermal bump include display drivers, microprocessors, chip sets, RF devices, medical devices, watches, smartcards and analog/mixed signal devices.

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