STATS ChipPAC announces Chinese expansion
The new facility almost doubles the company's current floor space of422,000 square ft, further strengthening STATS ChipPAC's position asthe largest full turnkey assembly and test service provider in China.STATS ChipPAC Shanghai offers high volume, low cost turnkey solutionsincluding wafer probe, assembly, final test and distribution to supportmultiple customers in markets such as PC chipsets, computing, consumerand broadband applications. I
n addition to the recent floor space expansion, STATS ChipPAC has beenrapidly building its technology portfolio in China with advanced dieattach and wire bond processes, advanced mould processes, film die attachand wafer thinning. With high volume production experience in PlasticBall Grid Array (PBGA) packages, three dimensional (3D) stacking andSystem-in-Package (SiP) solutions, STATS ChipPAC Shanghai is one of themost advanced integrated circuit (IC) subcontractors in China. STATSChipPAC is also adding a turnkey flip chip solution from bump, sort andassembly to final test in China.
"Today we celebrate the significant milestones and success that STATSChipPAC Shanghai has achieved over the past 12 years and the potentialfor growth we believe is ahead. From research and development todesign, assembly, and test, we have the resources, equipment, andadvanced processes necessary to ensure our customers have a competitiveedge in their markets," said Lee Yik Choong, President and ManagingDirector, STATS ChipPAC Shanghai.
