Intel opens first high-volume 45nm microprocessor factory
Called ‘Fab 32,' the US$3 billion factory will use Intel's innovative 45nm process technology based on Intel's breakthrough in ‘reinventing' certain areas of the transistors inside its processors to reduce energy leakage. The 45nm transistors use a Hafnium-based high-k material for the gate dielectric and metal materials for the gate, and are so small that more than 2 million can fit on the full-stop at the end of this sentence. Millions of these tiny transistors will make up Intel's faster, more energy efficient lead and halogen free processors for PCs, laptops and servers, as well as ultra low-power processors for mobile Internet and consumer electronic devices, and low-cost PCs.
Fab 32 is Intel's sixth 300mm wafer factory and its second factory to produce 45nm chips. Intel first produced 45nm processors in its Oregon development facility, called D1D, in January and are now moving into high-volume production with the opening of Fab 32. Two additional 45nm, 300mm manufacturing factories are scheduled to open next year in Kiryat Gat, Israel (Fab 28) and Rio Rancho, N.M. (Fab 11x). Using 300mm wafers lowers the production cost per chip while diminishing overall use of resources.With 184,000 square feet of clean room space, the completed Fab 32 structure measures 1 million square ft. More than 1,000 employees will operate the factory in such positions as process, automation and yield engineers and senior manufacturing technicians.
Fab 32 will be among Intel's most environmentally friendly factories, incorporating a number of energy and water conservation measures.Intel's 45nm process results in a 15% reduction in global warming emissions, and Fab 32 makes use of Intel Arizona's innovative water conservation and reuse program that conserves more than 70% of the water.
