STC releases draft of terminology specifications to semiconductor industry
They have announced that its Docking & Interface Working Group (DIWG) has published the first draft of terminology specifications for the Semiconductor Test Interface eXtensions (STIX) initiative. Successful standardisation of terminology specifications promises to increase supply chain efficiencies and reduce the risks arising from miscommunications between design, manufacturing, sales and purchasing personnel.
Moving quickly after their first meeting in January of this year the Docking & Interface Working Group established standard terminologies in the most critical, interface-related areas, including the X-Y-Z axes with respect to testhead orientation, convention for contact sight numbering, minimum set of docking interface connections, and defining the various interface levels for the testhead, loadboard, contactor and handler. In order to tackle such a wide range of subjects expeditiously the group split into five task-force team, prober, handler, docking and interface, tester and manipulator. Their cooperation and fast results validate the multi-company process the STC is taking to realise the broader goals of the entire STIX initiative.
The STIX initiative is designed to foster pre-competitive collaboration across the global semiconductor test supply chain, as part of a comprehensive and unified effort to deliver ATE interface standards. It encompasses both open hardware and software specifications for all peripheral areas around the ATE, regardless of tester architecture or vendor. By standardising these interfaces, integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) service providers can benefit by gaining higher equipment utilisation and easier line balancing. In addition, equipment suppliers can benefit by reducing the need for redundant research and development (R&D) efforts in non-differentiating product areas.
