ASML report new lithography opportunities
ASML told investors its estimates are based on semiconductor market forecasts and customer node transition roadmaps, combined with expectations for higher lithography demand for making advanced generations of semiconductors.
The company also reiterated its plans to achieve €5 billion in revenues by 2010. It stressed this estimate is supported by accelerating success of its immersion lithography machines.It added, to date, more than four million silicon wafers have been processed with its immersion systems, enabling customers to make more powerful or cheaper semiconductors.
ASML told financial analysts it is pushing ahead fast with developments in Extreme Ultraviolet (EUV), computational lithography, double patterning, as well as 3D device integration enablers like overlay and CD uniformity.
"All options require sophisticated lithography which is expected to lead to continued growth of overall lithography expenditures, while playing to ASML's strengths in leading technology, high productivity and best value of ownership," the company reported.