News Article
STMicroelectronics start construction of new test facility in China
;STMicroelectronics has laid the first stone at the site of its future chip packaging and test facility in Longgang, Guangdong Province, China.
ST's Longgang site has been designed to house up to 40,000 square metres of manufacturing space, with a capacity for approximately 5000 employees, when fully built. The first 20,000 square metre building is expected to be completed by the end of September 2008, followed by the installation of the manufacturing equipment in Q4 2008. When complete, the Longgang plant will be among ST's largest packaging and test facilities worldwide.
In its first year of operation, the Longgang packaging and test plant is expected to produce more than 800 million units. The output can scale to more than 10 billion units per year at full ramp-up, which would represent around 20% of ST's current total back-end production. The Longgang plant will primarily assemble and test ST's power conversion devices for use by ST's customers worldwide.
STMicroelectronics is a long-time leader in the China semiconductor market with a strong integrated presence of manufacturing, design, research, sales and marketing operations. In 2006, ST was the fourth largest semiconductor supplier in Greater China (China, Hong Kong and Taiwan).
China is the world's fastest growing semiconductor market, expected to make up one fifth of the global semiconductor market within the next five years.
