Rudolph to ship multiple transparent thin film metrology tools to Taiwan memory foundry
Multiple tools in each of the next two quarters are scheduled to ship to a leading memory foundry in Taiwan, with one additional system also scheduled to ship this quarter to a fab in Europe. Recent interest in Rudolph's transparent film systems from major fabs in Asia and Europe indicates strong, early market acceptance of the new tool.
Combining Rudolph's industry-standard multi-wavelength focused beam ellipsometry (FBE) and a new, faster, deep ultraviolet reflectometer (DUVR) on the company's high-speed XPort automation platform, the S3000A System delivers a 25% throughput improvement over the current tool and the lowest cost-of-ownership (CoO) available in the market today.
Rudolph's transparent film metrology tools deliver reliable measurements in high-volume production in advanced fabs around the world. It was the first company to deliver multi-angle, multi-wavelength ellipsometry for transparent thin film and OCD metrology. Stabilised laser diodes (633nm, 784nm, and 923nm) in the S3000A system further enhance the technology's inherent advantages in accuracy and precision, tool matching and long-term stability.
The tool's new, fast DUV reflectometer uses parallel data collection to improve throughput, precision and spectral resolution. The XPort platform provides superior wafer handling with up to four industry-standard TDK load ports, a dual-arm robot and built-in control of molecular airborne contaminants. The platform's Windows-based software delivers fast, efficient operation in a familiar software environment.
