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Common Platform group may double spend on packaging
The IBM-led Common Platform alliance plans to increase its investment in semiconductor packaging technology to pave the way to 32nm devices.
The nine-member alliance which includes Chartered Semiconductor and Samsung may double its current level of spending in the area, according to an IBM executive at the first ever Common Platform Technology Forum in California on 6 November.
"Our silicon road map is very robust, but our packaging investment is not where it needs to be," said Michael Cadigan, general manager for semiconductor solutions at IBM.
Smaller form factor packages and stacking technology are two areas where the group needs to place more focus, Cadigan said. Although packaging specialist Amkor Technology is part of the alliance, the group has "not yet fully engaged in advanced packaging issues with them," he added.
"We cannot make 32nm devices without new high density packaging technologies such as through-hole vias," said Philippe Magarshack, a group vice president at STMicroelectronics, one of the newest members of the alliance.
STM joined the Common Platform group in July to gain access to its 32nm technology. The company expects to have a 45nm process available in late 2008 as part of its co-development with the Crolles consortium.
