News Article
Infineon to collaborate with Intel to develop high-density SIM cards
Infineon Technologies AG has announced a strategic technology collaboration for the development of optimised chip solutions for high-density (HD) SIM cards with Intel Corporation.
Under the terms of the agreement, Infineon will architect modular chip solutions with Intel offering memory capacities from 4MB to 64MB (Megabytes). Infineon contributes its expertise in security hardware and will develop a 32-bit security microcontroller based on its existing SLE 88 family for use with HD SIM cards. Intel is contributing its flash memory technologies, capabilities and manufacturing.
The close technical collaboration will allow Infineon's HD security microcontroller to be optimally calibrated with Intel's flash memory solutions for efficient integration into HD SIM cards. The initial development of the flash memory product line will scale up to 64 MB with NOR flash memory manufactured on 65-nanometer (nm) and 45-nm process technologies.
The security microcontroller is currently produced on 130-nm process technology, which isstate-of-the-art for chips used in smartcard applications. All HD SIM solutions operate across the voltage range of 1.8 V to 3.3 V according to ETSI specifications. The SLE 88 family concept allows the operating system software developed for existing SIM cards to be easily reused.
Samples of the Intel / Infineon HD SIM card solution will be available in the second half of 2008, with high-volume production expected in the first half of 2009. The products will be sold in die form or in a chip card IC package.
