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MEMS, packaging groups to support others' efforts

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The MEMS Industry Group (MIG), a trade association representing MEMS and microstructure industries, and the MicroElectronics Packaging and Test Engineering Council (MEPTEC) have formed an alliance to support each other's goals and industry events, through a variety of marketing programs.
MEMS device manufacturing presents special challenges, including the ability to withstand electromechanical, thermomechanical and other stressors and still remain robust and reliable, noted MEPTEC president Bette Cooper, in a statement. "Bridging the gap between standard semiconductor packaging and MEMS packaging is one way to address these challenges, and it is this convergence that has been our focus," she said. "Our collaboration with MEMS Industry Group will help us to further explore this promising technology. "MIG and MEPTEC will join forces "to address the packaging issues that can further enhance the adoption and commercialisation of MEMS," stated MIG managing director Karen Lightman. Among the joint efforts, the two groups will support each other's upcoming events.
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