News Article
STATS ChipPAC expands flip chip offering
STATS ChipPAC Limited, an independent semiconductor test and advanced packaging service provider, have announced that it is expanding its flip chip offering to provide customers a complete turnkey solution in China.
STATS ChipPAC's operation in Shanghai, China will provide high volume, low cost, full turnkey flip chip solutions encompassing wafer bump, sort, assembly and final test.
The Company is following a two-phased approach to extend its full turnkey flip chip offering to China. The first phase is the addition and qualification of assembly and test equipment specifically tailored to high volume manufacturing of flip chip packages. STATS ChipPAC Shanghai recently completed internal qualification of flip chip assembly and test. Customer qualification is ongoing and is expected to be completed in the fourth quarter of 2007. Volume manufacturing is expected to begin in the first quarter of 2008.
In the second phase, electroplated wafer bumping will be added to complete the full turnkey service offering in China. Electroplated wafer bumping technology is crucial to achieving superior bump quality, higher yield, and finer bump pitches over other wafer bumping methods. Electroplated wafer bumping on 8-inch (200mm) silicon wafers is scheduled to be added in the first half of 2008 followed by the addition of 12-inch (300mm) wafer bumping in the second half of 2008.
"As demand for flip chip technology continues to grow in applications such as high performance ASICs and graphics as well as DSPs and integrated 3D packages for mobile platforms, it will be essential to have a low cost, high volume manufacturing location for flip chip solutions. We have successfully ramped advanced technologies in China and believe it is an important strategic location for customers who are looking for cost effective flip chip technology," said Wan Choong Hoe, Executive Vice President and Chief Operating Officer, STATS ChipPAC.
The Company's current flip chip portfolio ranges from large single die packages with passive components used for graphics and ASIC devices, to modules and complex three dimensional (3D) packages that contain logic, memory and radio frequency (RF) devices and integrate flip chip and wire bonding interconnection within the same package.
"Over the last three years, STATS ChipPAC has focused on aggressively expanding its flip chip portfolio in terms of technology, manufacturing capacity and geographic footprint. Our new service offering in China complements our advanced flip chip portfolio in South Korea as well as our bumping capabilities in Taiwan and Singapore. Flip chip technology is an important part of our plan to grow STATS ChipPAC Shanghai into a mega site for full turnkey backend solutions encompassing wafer bump, sort, assembly and final test," said Wan.
