News Article
SUSS MicroTec receives multiple wafer level packing equipment orders from ASE
Suss MicroTec has received multiple orders for its lithography production equipment from the ASE Group, a provider of independent semiconductor manufacturing services in assembly and test.
The first order packages were booked in October and November and included several production mask aligners and coat/bake/develop clusters for 200 and 300mm, that will be installed at ASE's wafer level packaging and redistribution process facility in Kaohsiung, Taiwan.
Wafer level packaging is an advanced packaging technology whereby the die and ‘package' are manufactured and tested on the wafer, then diced into individual packaged ICs. 300mm wafer level packaging technology is vital for continuous improvement in the quality and cost of high-technology products.
