Applied Materials’ UVision 3 sets benchmark for Brightfield inspection sensitivity and productivity
Delivering significant advancements to Applied's breakthrough UVision technology, this next-generation system triples the number of laser beams scanning the wafer to provide 40% faster throughput than any competitive system. Two new imaging modes extend sensitivity to 20nm, and a new flexible automatic defect classification engine enables quick access to defects of interest and faster yield learning.
"The UVision 3 system's multi-beam DUV laser architecture allows extendibility beyond the resolution limits of traditional optical inspection," said Dr. Gilad Almogy, vice president and general manager of Applied Materials' Process Diagnostics and Control group. "With this enhanced system, leading-edge memory and immersion lithography manufacturers can run volume production at engineering tool sensitivity with a shorter cycle time to generate meaningful data. We have shipped multiple UVision 3 systems to customers where they have validated its sensitivity at groundbreaking DUV Brightfield throughputs."
By coupling unique laser DUV architecture with a sensitive photo-multiplier tube (PMT) and variable polarisation, the UVision 3 system also meets the challenges of 32nm memory development. New Brightfield imaging modes, both in the illumination and collection path, address the contrast versatility required for immersion lithography. In addition, the system's innovative algorithms of high defect accuracy and stitch-to-stitch detection enable enhanced sensitivity on periphery areas, a key advantage not addressed by any other Brightfield system.
