News Article
TSMC ships one-millionth 12-inch 90nm wafer
Taiwan Semiconductor Manufacturing Company Limited has announced that it has shipped its one-millionth 12-inch 90-nanometer (nm) wafer in record time. The record was reached in just 53 months, surpassing the 58 months it took the 0.13-micron process to reach that milestone.
TSMC Vice President, Corporate Development, Jason Chen credits the fast ramp of 90nm process to a number of factors, including a comprehensive IP and library portfolio and an accelerated yield learning curve. He also cited the TSMC GigaFab manufacturing strategy that enables faster qualification and assured compatibility that allows fastertime-to-market and time-to-volume. TSMC's 90nm process covers a rich set of technology options including mixed signal, RF, CMOS image sensor, automotive, and embedded DRAM. The robust technology platform supports broad range of market segment demand such as hard disk drives, wireless LAN, Bluetooth, cellular RF, digital set-top boxes, digital TV, Blueray DVD, CMOS image sensors, flash controller and a variety of automotive applications.