News Article
EVG and Brewer Science claim wafer 'milestone'
EV Group, a supplier of wafer-bonding and lithography equipment for the MEMS and nanotech markets, and Brewer Science Incorporated, a developer of semiconductor technology, have claimed a ‘milestone’ in handling and processing of ultrathin wafers.
The companies have announced they have demonstrated temporary wafer bonding capabilities for a wide range of backside processes, including through-silicon vias (TSVs) and backside metallisation.
The partnership between the companies was formed in July "to address growing industry demand for flexible, yet reliable, processes and equipment that can accommodate the challenges associated with increasingly thin and fragile product wafers, particularly for advanced 3D and wafer-level packaging approaches," according to a press release.
