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News Article

Rudolph to purchase RVSI Inspection

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Rudolph Technologies, a provider of process characterisation equipment and software used in wafer processing and semiconductor final manufacturing facilities announced that it has acquired all intellectual property and selected assets from privately held RVSI Inspection.

The addition of RVSI's bumped wafer inspection system to its product portfolio is expected to strengthen Rudolph's established presence in the high growth, advanced packaging market.

"We are pleased to announce the close of this transaction," said Paul F. McLaughlin, chairman and chief executive officer of Rudolph. "This purchase, as well as our recently announced acquisition of Applied Precision's probe card test and analysis business, was orchestrated to enhance our position as a dominant supplier of inspection and metrology solutions for an increasing number of back-end applications."

"The RVSI tool is the perfect complement to the Rudolph macro defect inspection system, which is the workhorse tool of choice deployed in most of the leading fabs around the world," McLaughlin continued. "We believe these high performance systems will give our customers a comprehensive solution for both 2D and 3D inspection."

"We will be adding an excellent technical team to our Rudolph organisation, and expect to quickly and efficiently fold the RVSI operations into our existing inspection business," said Nathan Little, executive vice president and general manager of the Inspection Business Unit. "With a high level of customer overlap, combined with our existing global applications and service support network, our goal is to make this transition as seamless as possible."

"We're excited about joining the Rudolph team," said Reza Asgari, vice president of sales at RVSI. "We're looking forward to leveraging the know-how of our engineering teams to continue delivering advanced 2D/3D bumped wafer inspection capability that our customers demand."

Consumer demand for thinner and multi-function devices is driving the market for advanced packaging. As scaling by device shrink becomes more difficult and expensive, advanced packaging enables increased package density.
Rudolph will maintain a technology centre for the wafer scanner products in Hauppauge, NY, but will relocate the associated manufacturing activities to its Inspection Business Unit in Bloomington, Minnesota. Terms of the transaction were not disclosed.

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