News Article
Metryx receives multiple system order from Inotera
Mass metrology company, Metryx, Limited, announced the receipt of a multiple system follow-on order from Taiwanese semiconductor memory manufacturer, Inotera Memories. The order is for Metryx' Mentor DF3 platform and will be used initially to monitor etch applications.
"Winning follow-on orders is another significant step forward for both company and technology," stated Dr. Adrian Kiermasz, president and CEO of Metryx. "Clearly, leading-edge manufacturers are seeing the benefit of the technology and are finding it increasingly indispensable to their manufacturing productivity."
The Mentor DF3 offers atomic layer measurement accuracy for high volume 300 mm manufacturing environments. Designed to monitor changes in process performance, the DF3 quickly determines whether device manufacturer's process steps are operating correctly by measuring the mass of any wafer following a process step. Simple comparison with the measurements of a reference wafer enable the tool to reliably and accurately identify process changes after deposition, wet or dry etch, or CMP processing. The tool achieves measurements with a resolution of 10 micrograms and accuracy equivalent to 1 to 5 Angstroms in thickness, depending on the material type.
"The Mentor's ability to effectively monitor our processes and keep process tools from drifting were the key to our decision to place additional orders for Metryx' technology," stated Joey Hsu, Deputy Director of Advanced Engineering Service at Inotera. "The fact that the DF3 can be used in-line and on product wafers makes it particularly effective in a high-volume manufacturing environment."
The Mentor DF3 offers atomic layer measurement accuracy for high volume 300 mm manufacturing environments. Designed to monitor changes in process performance, the DF3 quickly determines whether device manufacturer's process steps are operating correctly by measuring the mass of any wafer following a process step. Simple comparison with the measurements of a reference wafer enable the tool to reliably and accurately identify process changes after deposition, wet or dry etch, or CMP processing. The tool achieves measurements with a resolution of 10 micrograms and accuracy equivalent to 1 to 5 Angstroms in thickness, depending on the material type.
"The Mentor's ability to effectively monitor our processes and keep process tools from drifting were the key to our decision to place additional orders for Metryx' technology," stated Joey Hsu, Deputy Director of Advanced Engineering Service at Inotera. "The fact that the DF3 can be used in-line and on product wafers makes it particularly effective in a high-volume manufacturing environment."
