Rohm and Haas introduces next generation CMP pad
Designed for defectivity reduction in shallow trench isolation (STI) and interlayer dielectric (ILD) applications, the new pad targets volume manufacturing of memory and logic chips at 65 nm and below. The VisionPad 5000 features an advanced polymer specifically designed by CMP Technologies to lower defectivity on all types of commercial slurries. Also key to the design of VisionPad 5000 is an optimized pore size and pore concentration. Rohm and Haas has done extensive R&D to fully understand the complex relationship between polymers, pore size and pore density. This knowledge resulted in the design of unique pads targeted at specific processes. The mechanics of STI scratch defects during CMP are directly related to the interaction of materials at the interface of the pad with the wafer surface. To address this issue, Rohm and Haas developed the VisionPad 5000 with an optimized polymer and pore structure designed to improve the robustness of STI CMP processes. In addition, the VisionPad 5000 achieves a 50 percent reduction in CMP-induced scratch and chatter marks over current materials. The VisionPad 5000 results in improved planarisation overall and when coupled with ceria based polishing slurries, the removal rate is also enhanced.
"The VisionPad 5000 is the newest pad designed and manufactured in line with our application specific approach to CMP pads, allowing us to deliver the highest performing and most consistent new technologies for specific process steps," stated Dave Ventura, pad marketing director for Rohm and Haas Electronic Materials, CMP Technologies. The continual line shrinks in microchip devices demands lower defects during CMP polishing steps, and this becomes especially critical for non metal applications.
To achieve lower defectivity with good planarity, the VisionPad 5000 uses an energy absorbent polymer in a unique formulation. It has demonstrated performance factors that are equal to the industry standard IC1000 pad, including removal rate, dishing, erosion, process window and planarity, while reducing defectivity by at least 50 percent. Other features include a long pad lifetime and multiple grooving, sub pad and adhesive configurations. Polishing and conditioning recommendations are also offered by Rohm and Haas.
The VisionPad 5000 pads offer predictable pad-to-pad performance and stable operation throughout the process. To ensure the highest quality and consistency, all VisionPad products are manufactured using stringent SPC/SQC methods. VisionPad products will be manufactured and supported in Rohm and Haas's new facility in Taiwan as well as the Company's existing manufacturing site in the United States. VisionPad 5000 CMP pads are now available for sampling.
