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News Article

Spansion selects Sokudo's tracks for 32nm immersion lithography

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Flash memory solutions provider, Spansion, has selected the new RF3S coat/develop track system from Sokudo Co., Ltd to develop 193nm immersion processes for its 32nm Flash devices.
"We have performed a thorough evaluation of available track tools to support Spansion's second generation immersion lithography technology and have selected the RF3S based on its exceptional performance and competitive cost," said John Behnke, vice president of Process Development and Transfer at Spansion. "This alliance demonstrates the industry's growing need for early collaboration. The close proximity of the SDC, which is the only full flow 300mm process/product development line in the Silicon Valley, to Sokudo's development site at Applied Materials' Maydan Technology Centre, will serve to strengthen the effectiveness of our development teams. We look forward to working together with Sokudo to develop our next generations of world class Flash technology to meet the expanding needs and challenges of our customers."

Sokudo's RF3S system demonstrated less than 1.0nm, 3 sigma critical dimension (CD) uniformity on 45nm features and immersion defect density of less than 0.1 defects/cm2. Technologists from the SDC and Sokudo will collaborate to fully optimise the performance of the second generation immersion lithography cell to meet the increased patterning and manufacturing challenges at the 32nm node and beyond. The Spansion-Sokudo team will take advantage of the RF3S system's integrated clean technology to take immersion lithography to the new levels of defect control required for 32nm.

According to Takashige Suetake, CEO of Sokudo, "This agreement will provide Sokudo with an opportunity to qualify our immersion technology for leading flash memory applications. We are excited to be working with Spansion and believe that this collaboration will help to ensure that benchmark process and immersion defect control is available for 32nm immersion processes."

The RF3S system was delivered to Spansion's Submicron Development Centre (SDC) in Sunnyvale, CA, in late 2007.
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