Chip bonding markets on the rise
Electronic devices such as camcorders, MP3 players and personal digital assistants continue to get smaller and semiconductor developers respond to this consumer trend by designing smaller package types. The reduced footprints of semiconductor packages have made accuracy imperative in chip bonder machines and this development fuels growth in the chip bonder market. New analysis from Frost & Sullivan World Chip Bonder Markets, finds that the market earned revenues of $908.7 million in 2006 and estimates earnings will reach $1.7 billion in 2013.
In order to achieve higher precision, chip bonder equipment manufacturers will need to increase the capabilities of die handling. This will also ensure that additional steps in the packaging processes do not present assembly dilemmas for the equipment. Technology trends such as stacked packages, system in package (SiP), package on package (PoP) and flip chip in package (FCiP) types will positively impact the advanced packaging equipment market. Integrated circuit (IC) developers and equipment manufacturers will derive cost effective solutions from these package types.
"With the high volume manufacturing of semiconductor packages, these technology trends will help equipment manufacturers to provide robust solutions to end-users," says Frost & Sullivan Research Analyst Julian Harris. "The increased functionality and low overall packaging cost will offer adaptable solutions to both suppliers and customers."
However, chip bonder equipment manufacturers are beginning to feel the strain of finding a system solution for end users who will use smaller semiconductor packages in their electronic products. Customizations required by end users include specific bonding processes and additional machine capabilities such as hybrid applications.
"End users are demanding simple solutions from equipment suppliers to manufacture semiconductor packaging machines that incorporate numerous attachment applications, from epoxy-die bonding to high- and low-end flip chip applications," explains Harris. "Considering these different applications require different component settings, such as placement accuracy and die handling, equipment manufacturers are implementing manufacturing processes to decrease machine footprint."
Meanwhile, the handling of very thin die also poses a challenge to the machine components of chip bonder equipment. Suppliers must implement a strategy to modify machine capabilities in order to accommodate the requirements of package developers.
"For instance, machine components such as an optimal indexer will provide excellent handling, higher throughput, and increase the transfer rate of lead frames or thin substrates that complicate the die attach process," notes Harris. "With the incorporation of proper vision systems, the quality of pre- and post-bonding processes is expected to increase and save costs for end users."
