News Article
Renesas Technology to expand back-end process with new building
The newly expanded facility will operate as one of the world's largest MCU plants for back-end manufacturing.
Renesas Technology today announced plans to invest ¥4 billion to add a new building at its back-end process plant, Renesas Semiconductor Beijing (RSB), to increase its capacity for microcontroller (MCU) production. A ceremony for celebrating the start of construction will be held on March 26 with representatives from the city of Beijing and Renesas.
Renesas aims to increase its current MCU market share from 25 percent globally (Renesas estimated) to 30 percent to solidify its position by boosting the MCU production. In order to do so, Renesas will continue to provide MCU based solutions to China’s growing MCU market among others. Also, Renesas is now streamlining its back-end process resources by increasing production at overseas facilities for high volume products to remain price competitive. A new building is being added in Beijing to enable Renesas to achieve these goals.
The new building is expected to be completed and ready for full operation by the end of fiscal 2008. The expansion effort will also increase the production floor area by 60 percent, from 18,000 m2 to 29,000 m2. At the same time, RSB's total manufacturing capacity for MCUs, mixed signal ICs and other products will increase from 50 million units per month in fiscal 2007 to 100 million units in fiscal 2012. In addition to high volume products, RSB also has the production line to manufacture MCUs for automotive applications to respond to the growing demand of the Chinese automotive market. Besides RSB in Beijing, Renesas also owns a back end process plant in Suzhou, Renesas Semiconductor (Suzhou) Co., Ltd. (RSC). Together, both plants (RSB and RSC) manufacture 70 million units today, and the total capacity is expected to grow to 140 million units in fiscal 2012 after the new plant comes on stream.
