News Article
Samsung selects Infineon chips
Infineon to supply HSDPA platform for Samsung’s HEDGE mobile phone family
Infineon Technologies announced that Samsung Electronics, Korea, has chosen Infineon’s HSDPA Platform for their new family of HEDGE mobile handsets. Samsung is introducing a comprehensive family using the Infineon platform.
The platform includes the HSDPA/EDGE baseband, power management, single chip 3.5G RF transceiver and is complemented by Infineon’s protocol stack for HEDGE phones. This state of the art solution enables customers to significantly reduce their component count, footprint, complexity and cost of designs.
The launch also underlines the global maturity of Infineon’s in-house protocol stack. The platform will enable Samsung to introduce a wide range of new HEDGE phones reusing the proven Infineon core architecture. Infineon has already started volume shipments of its platform. The Samsung HEDGE phones are expected to be available in the second quarter of calendar year 2008.
