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A groovy kind of slurry

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Rohm and Haas cuts cost of consumables for Tungsten CMP by 20 percent with new groove design to reduce slurry consumption
Rohm and Haas Electronic Materials CMP Technologies, a provider of chemical mechanical planarisation (CMP) technology for the global semiconductor industry, unveiled a groove design for its IC1000 AT and VisionPad CMP pads. The new design achieves up to a 35 percent reduction in slurry consumption, which equates to approximately a 20 percent reduction in the total cost of consumables for Tungsten CMP. The patent pending slurry reduction groove design, which targets 200 mm and 300 mm Tungsten polishing processes, works by improving slurry delivery to the leading edge of the wafer. This innovative design is more efficient, meaning less slurry is required, which translates into major cost savings for IC manufacturers. “Tungsten slurry is an extremely expensive component in the CMP process, leading IC manufacturers to seek alternative solutions to reduce the cost of consumables for this critical process step,” said Mario Stanghellini, executive vice president of global sales and marketing for Rohm and Haas Electronic Materials, CMP Technologies. “Our understanding of CMP process fundamentals was instrumental in delivering this step out cost improvement for Tungsten CMP and directly responds to the needs of our customers.” In testing on site and in customer facilities, the new pad has reduced slurry consumption by up to 35 percent in Tungsten polish without sacrificing removal rate, defectivity or uniformity performance. The product is currently undergoing full beta testing and is available for sampling by engaged partners.
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