News Article
TSMC says it will enter the MEMS market
At a recent press meeting, Taiwan Semiconductor Manufacturing Co Ltd (TSMC), announced it will enter the MEMS market on a full scale
The Taiwanese Si foundry presented a road map of the MEMS process and its policy to enter MEMS market. TSMC plans to provide bulk and surface micromachining as well as processes for the manufacturing of CMOS MEMS integration and packaging. New chip to chip bonding processes for packaging are also planned alongside a coating technique to solve a MEMS inherent sticking problem.
Robert Chin-fu Tsai, director of MEMS programme at TSMC, reflects that the MEMS industry is undergoing a major shift. This is due to, limited, mainly in house manufacturing, recently turning to consumer devices and mobile communication devices.
MEMS technology is not only put in service inside integrated device manufacturers (IDM), fables and venture companies use the technology as well. So far, MEMS devices have been produced by IDMs, although the production has gradually shifted to independent foundries.
The company’s MEMS business plans will be announced at a technical seminar at ‘MEMS International 2008’ in May 2008.
