News Article
Cluster tool goes to Korea
MEMS foundry in Korea selects SUSS Automated Bond Cluster
SUSS MicroTec, a supplier of process and test solutions for the semiconductor industry, announced that u-ITC, Korea, has selected wafer bonding equipment of SUSS for its MEMS foundry.
u-ITC is a MEMS foundry specialising in MEMS sensors. The Incheon facility will incorporate design, manufacture, assembly and test within one location for the growing fabless MEMS market.
“The SUSS ABC200 Automated Bond Cluster is a key acquisition for our foundry operations,” said Suh, Dong-Ryang Ph.D, Director at u-ITC, “we can easily meet our customers’ needs by using a cluster tool that can be quickly reconfigured for changing process conditions.”
“The flexibility of the SUSS bond cluster to quickly reconfigure process parameters from small runs to full production is a big advantage of the toolset, especially in the case of a foundry serving new markets,” said Daniel T. Hurley, International Product Manager, Wafer Bonder Division, SUSS MicroTec. “We are pleased to support u-ITC as they establish themselves as the primary best in class MEMS foundry in Korea.”
u-ITC is a MEMS foundry specialising in MEMS sensors. The Incheon facility will incorporate design, manufacture, assembly and test within one location for the growing fabless MEMS market.
“The SUSS ABC200 Automated Bond Cluster is a key acquisition for our foundry operations,” said Suh, Dong-Ryang Ph.D, Director at u-ITC, “we can easily meet our customers’ needs by using a cluster tool that can be quickly reconfigured for changing process conditions.”
“The flexibility of the SUSS bond cluster to quickly reconfigure process parameters from small runs to full production is a big advantage of the toolset, especially in the case of a foundry serving new markets,” said Daniel T. Hurley, International Product Manager, Wafer Bonder Division, SUSS MicroTec. “We are pleased to support u-ITC as they establish themselves as the primary best in class MEMS foundry in Korea.”
