News Article
NexPlanar secures $14.5 million
The
company will commercialise next generation semiconductor CMP pad
technology with the funding. Nano domains coupled with the ability to
tune pad properties enable next generation planarisation.
NexPlanar Corporation recently
completed a $14.5 million round of funding to commercialise the next
generation of chemical mechanical planarisation (CMP) pad technology
for semiconductor devices.
NexPlanar uses proprietary “nano domain” technology which improves planarity and across wafer uniformity and can be utilised to customise the pads for specific applications. The application specific CMP pads can be tuned, for example, for sensitive structures on the device by varying the hard and soft domains of the pad. NexPlanar’s “nano lubricants” and patented moulded groove technologies allow for low stress CMP (required for the most advanced CMP applications), result in an order of magnitude fewer defects, and allow the use of low slurry consumption processing.
InterWest Partners led the round of investment. Other existing investors participated, including BlueRun Ventures, Smart Forest Ventures, Fina Ventures, Intel Capital and Entegris.
“As device geometries shrink, there must be a paradigm shift in the CMP process. Our proprietary pad technology enables advanced processes while offering significantly improved yields in existing processes,” commented Jim LaCasse, CEO and President of NexPlanar. “Our mandate is to improve the CMP yields by improving the planarity and reducing defects, while at the same time lowering cost of ownership by increasing the pad life and lowering slurry consumption.”
“We wholeheartedly believe the marketplace is ready for a new competitor,” commented Khaled Nasr of InterWest Partners. “NexPlanar’s strong patent portfolio and application specific solutions, coupled with the industry experience of a world class management team and technical staff, will quickly position the company to become a significant player in the semiconductor industry.”
“At BlueRun Ventures we look for companies that can have a strong global presence,” said Sujit Banerjee, Partner. “NexPlanar’s technology applies to a broad range of customers in the U.S., Europe and Asia and we are excited to continue working with Jim and his team to create a world class business that leverages NexPlanar’s unique technology and BlueRun’s global network, particularly in Asia.”
NexPlanar’s patent portfolio and technology enables new material integration in advanced devices as called for in the ITRS roadmap. The company manufactures in Hopkins, Minnesota and at its new headquarters in Hillsboro, Oregon.
NexPlanar uses proprietary “nano domain” technology which improves planarity and across wafer uniformity and can be utilised to customise the pads for specific applications. The application specific CMP pads can be tuned, for example, for sensitive structures on the device by varying the hard and soft domains of the pad. NexPlanar’s “nano lubricants” and patented moulded groove technologies allow for low stress CMP (required for the most advanced CMP applications), result in an order of magnitude fewer defects, and allow the use of low slurry consumption processing.
InterWest Partners led the round of investment. Other existing investors participated, including BlueRun Ventures, Smart Forest Ventures, Fina Ventures, Intel Capital and Entegris.
“As device geometries shrink, there must be a paradigm shift in the CMP process. Our proprietary pad technology enables advanced processes while offering significantly improved yields in existing processes,” commented Jim LaCasse, CEO and President of NexPlanar. “Our mandate is to improve the CMP yields by improving the planarity and reducing defects, while at the same time lowering cost of ownership by increasing the pad life and lowering slurry consumption.”
“We wholeheartedly believe the marketplace is ready for a new competitor,” commented Khaled Nasr of InterWest Partners. “NexPlanar’s strong patent portfolio and application specific solutions, coupled with the industry experience of a world class management team and technical staff, will quickly position the company to become a significant player in the semiconductor industry.”
“At BlueRun Ventures we look for companies that can have a strong global presence,” said Sujit Banerjee, Partner. “NexPlanar’s technology applies to a broad range of customers in the U.S., Europe and Asia and we are excited to continue working with Jim and his team to create a world class business that leverages NexPlanar’s unique technology and BlueRun’s global network, particularly in Asia.”
NexPlanar’s patent portfolio and technology enables new material integration in advanced devices as called for in the ITRS roadmap. The company manufactures in Hopkins, Minnesota and at its new headquarters in Hillsboro, Oregon.
