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News Article

Rudolph Technologies sold its lead scanner assets

News
The company announced the sale of lead scanner assets to BKM Technology Partners.

Rudolph Technologies, a provider of process characterisation equipment and software used by semiconductor manufacturers, announced it has sold its lead scanner assets and licensed related intellectual property acquired from RVSI Inspection in January 2008, to privately held BKM Technology Partners. Under the terms of the agreement, BKM will provide global sales and service for the RVSI lead scanner product line.

“We are excited about adding the lead scanner to our semiconductor solutions portfolio,” said Barton A. Katz, BKM partner. “BKM is committed to providing world class support. Following a seamless transition of this business from Rudolph to our organisation, we intend to deliver this same level of support for lead scanner customers. BKM has previously supported the RVSI Lead Scanner product line in North America, so it makes sense to expand this expertise worldwide.”

Under terms of the agreement, the transfer of assets and inventory will be completed during the third quarter. BKM will provide global support, and all inquiries related to the lead scanner products will be redirected to BKM.

“Our screening process involved an extensive review of candidates to help ensure this business would be handled by an entity that could capably support lead scanner customers on a global scale,” said Nathan Little, executive vice president and general manager of Rudolph’s Inspection Business Unit. “As such, we will work closely with BKM through an appropriate transition period to facilitate a smooth hand off of the assets and related product support.”

Little added, “As the transition progresses and changes are made to our current support procedures, customers will be notified on a timely basis.”

The lead scanners provide final inspection solutions for a variety of semiconductor devices such as BGA (ball grid array), QFP (quad flat panel), TSOP (thin small outline package), etc. Device integrity and uniformity is ensured through dimensional inspection of leads and ball grids as well as visual inspection of package body for defects.

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