News Article
Qualcomm and IMEC collaborate on 3D integration research
IMEC
gathers all major supply chain players for its 3D integration
programme.
IMEC, Europe’s independent
nanoelectronics research institute, and Qualcomm, a developer and
innovator of wireless technologies and data solutions, announced that
Qualcomm is the first fabless integrated circuit company to
participate in IMEC’s industrial affiliation programme (IIAP) on
three dimensional (3D) integration. Qualcomm and IMEC researchers in
the program will collaborate to understand and develop solutions for
the use of 3D technologies in future wireless products.
"Now that Qualcomm has joined the 3D integration programme, we have all the major supply chain players working together," said Luc Van den hove, chief operation officer at IMEC. "We are confident that strong industry collaboration among foundries, IDMs, packaging and assembly companies, and equipment suppliers at IMEC will push the development of innovative 3D products forward."
IMEC’s 3D integration programme explores three dimensional technology and design for application in various domains. The technology research program focuses on 3D wafer level packaging and 3D stacked ICs to find innovative solutions for the cost effective use of 3D interconnects at different levels of the wiring hierarchy. The 3D system on chip design research programme provides insights to its benefits, costs, challenges and solutions. The programme will also include the development and demonstration of the IP and tools necessary for designing in three dimensions.
"Three dimensional design will allow Qualcomm to offer superior features and performance in our products," said Jim Clifford, senior vice president and general manager, Qualcomm CDMA Technologies. "We are collaborating with IMEC because their research and technology expertise will help us to accelerate the implementation of 3D design in our products."
Other partners in IMEC’s 3D integration programme are Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.
"Now that Qualcomm has joined the 3D integration programme, we have all the major supply chain players working together," said Luc Van den hove, chief operation officer at IMEC. "We are confident that strong industry collaboration among foundries, IDMs, packaging and assembly companies, and equipment suppliers at IMEC will push the development of innovative 3D products forward."
IMEC’s 3D integration programme explores three dimensional technology and design for application in various domains. The technology research program focuses on 3D wafer level packaging and 3D stacked ICs to find innovative solutions for the cost effective use of 3D interconnects at different levels of the wiring hierarchy. The 3D system on chip design research programme provides insights to its benefits, costs, challenges and solutions. The programme will also include the development and demonstration of the IP and tools necessary for designing in three dimensions.
"Three dimensional design will allow Qualcomm to offer superior features and performance in our products," said Jim Clifford, senior vice president and general manager, Qualcomm CDMA Technologies. "We are collaborating with IMEC because their research and technology expertise will help us to accelerate the implementation of 3D design in our products."
Other partners in IMEC’s 3D integration programme are Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.
