News Article
Intermolecular and Elpida launch R&D collaboration
The
collaboration has been launched for next generation memory
technology.
Intermolecular announced a new
collaborative development programme (CDP) and licensing agreement
with Elpida Memory, a global memory supplier, to enable rapid
development of new materials and process technologies for Elpida’s
next generation ICs. The CDP will utilise Intermolecular's physical
vapour deposition (PVD) and atomic layer deposition (ALD) work flows
and applications.
Based on Intermolecular’s high productivity combinatorial (HPC) technology, the programme with Elpida will focus on development of advanced memory technology suitable for high volume manufacturing.
Based in Intermolecular’s San Jose facility and supported by the company’s informatics web based software, the programme will involve close collaboration between Intermolecular and Elpida’s development office. Intermolecular’s informatics software system serves as a backbone for seamlessly integrating processing and characterisation tools into unified R&D work flows. For example, the informatics system provides for automated generation and execution of experiments, design and tracking of experimental splits and the associated metrology and e-test data, and use of statistical best known methods to automatically analyse and interpret data and generate reports.
“This partnership with Intermolecular will significantly broaden and accelerate the scope of materials evaluation and process integration for our advanced memory technologies,” said Takao Adachi, Elpida director, chief technical officer, Future Technology Development Office. “To successfully compete in today’s memory market, it’s critical to rapidly develop, qualify and deliver the best performing products to customers. Collaborating with Intermolecular on R&D will strengthen our leadership position in the memory sector.”
“This agreement with Elpida is a powerful endorsement of our HPC technology,” said David Lazovsky, Intermolecular’s chief executive officer. “Our collaborative development program enables this memory leader to produce hard data with unprecedented speed by conducting hundreds of individual experiments in parallel. The result is fast, confident decisions on the properties and manufacturability of innovative materials, process technologies and device structures identified and developed in this program.”
As part of Intermolecular’s Tempus HPC platform, the PVD and ALD systems enable rapid development for both front end of line (FEOL) and back end of line (BEOL) processes. Based on massively parallel processing, characterisation and informatics, the applications deliver dramatically faster R&D learning, greater return on investment and reduced risk.
Intermolecular is the semiconductor industry’s only provider of fully integrated combinatorial R&D technology, powered by systems and methodologies that radically accelerate discovery and integration of new materials, new process technologies and new device structures. The company’s Tempus HPC platform enables customers to maximise their R&D return on investment through economical high speed development, integration and electrical testing of a large number of alternative solution sets.
Based on Intermolecular’s high productivity combinatorial (HPC) technology, the programme with Elpida will focus on development of advanced memory technology suitable for high volume manufacturing.
Based in Intermolecular’s San Jose facility and supported by the company’s informatics web based software, the programme will involve close collaboration between Intermolecular and Elpida’s development office. Intermolecular’s informatics software system serves as a backbone for seamlessly integrating processing and characterisation tools into unified R&D work flows. For example, the informatics system provides for automated generation and execution of experiments, design and tracking of experimental splits and the associated metrology and e-test data, and use of statistical best known methods to automatically analyse and interpret data and generate reports.
“This partnership with Intermolecular will significantly broaden and accelerate the scope of materials evaluation and process integration for our advanced memory technologies,” said Takao Adachi, Elpida director, chief technical officer, Future Technology Development Office. “To successfully compete in today’s memory market, it’s critical to rapidly develop, qualify and deliver the best performing products to customers. Collaborating with Intermolecular on R&D will strengthen our leadership position in the memory sector.”
“This agreement with Elpida is a powerful endorsement of our HPC technology,” said David Lazovsky, Intermolecular’s chief executive officer. “Our collaborative development program enables this memory leader to produce hard data with unprecedented speed by conducting hundreds of individual experiments in parallel. The result is fast, confident decisions on the properties and manufacturability of innovative materials, process technologies and device structures identified and developed in this program.”
As part of Intermolecular’s Tempus HPC platform, the PVD and ALD systems enable rapid development for both front end of line (FEOL) and back end of line (BEOL) processes. Based on massively parallel processing, characterisation and informatics, the applications deliver dramatically faster R&D learning, greater return on investment and reduced risk.
Intermolecular is the semiconductor industry’s only provider of fully integrated combinatorial R&D technology, powered by systems and methodologies that radically accelerate discovery and integration of new materials, new process technologies and new device structures. The company’s Tempus HPC platform enables customers to maximise their R&D return on investment through economical high speed development, integration and electrical testing of a large number of alternative solution sets.
