News Article
Alchimer wins 'Best of the West' Award at SEMICON West 2008
The company has won the 2008 Best of the West Award at SEMICON West for its eG ViaCoat electrografted copper seed layer for TSV technology.
SEMICON West is the largest and most influential microelectronics exhibition in North America. Two Best of the West winners were selected from eight finalists by the prestigious judging panel made up of journalists, members of the academic community and industry leaders based on their engineering or scientific achievement, financial impact and/or societal contribution. Entrants were from the 1200 strong list of exhibitors representing 23 countries.
"With over 200 new products introduced at this year's SEMICON West, to be singled out by this diverse panel of judges is an enormous achievement," said Tom Morrow, vice president of global expositions at SEMI. "As this year's winners attest, SEMICON West is the world's premier venue for new product introductions in the microelectronics industry."
Alchimer has won for eG ViaCoat, its product for the electrografting of copper seed layers used for the metallisation of Through Silicon Vias (TSVs). Alchimer's electrografting innovation uses a wet electrochemical process based on specific organic precursors to enable the initiation and growth of nanometric films on conducting and semiconducting surfaces. The process produces conformal, thin, uniform and adherent copper layers, even on resistive barriers. Further, eG ViaCoat can be used on high aspect ratio TSVs, 10:1 and up.
"With over 200 new products introduced at this year's SEMICON West, to be singled out by this diverse panel of judges is an enormous achievement," said Tom Morrow, vice president of global expositions at SEMI. "As this year's winners attest, SEMICON West is the world's premier venue for new product introductions in the microelectronics industry."
Alchimer has won for eG ViaCoat, its product for the electrografting of copper seed layers used for the metallisation of Through Silicon Vias (TSVs). Alchimer's electrografting innovation uses a wet electrochemical process based on specific organic precursors to enable the initiation and growth of nanometric films on conducting and semiconducting surfaces. The process produces conformal, thin, uniform and adherent copper layers, even on resistive barriers. Further, eG ViaCoat can be used on high aspect ratio TSVs, 10:1 and up.
