News Article
Breaking partnership
JPSA
partners with DynTest Technologies for wafer scriber/breaker
development.
J P Sercel Associates (JPSA) announces
a collaborative partnership with DynTest Technologies of Grassau,
Germany, to develop and manufacture new high precision
scriber/breaker solutions for wafer singulation. DynTest specialises
in highly precise, accurate, and efficient breaking systems that
enhance production yields and productivity, while JPSA specialises in
high speed, high accuracy laser workstations for wafer scribing.
“The combined benefits of highly precise scribing and breaking technologies are the driving forces behind this collaboration” Rick Slagle, Sales and Marketing Director of JPSA, said. “JPSA’s laser scribing systems deliver the narrowest kerf in the industry, 2.5 microns, at high speed, for maximum yields per wafer. DynTest brings advanced, precise breaking expertise to this relationship. The combined technology of JPSA and DynTest Technologies allows thicker material to be singulated accurately, meaning less scribing time, higher throughput and higher yields.”
“This provides the industry new opportunities for traceable device singulation in high volume manufacturing” support Joerg Lindner and Helge Luesebrink, Managing Directors of DynTest Technologies.
“Furthermore, these systems can break very small, relatively thick VCSEL and HB-LED dies” Slagle added. The result of the collaboration will mean excellent process speed and performance with improved yield rates. In addition to the quite sensitive epitaxial material of VCSELs and HB-LEDs, wafers with backside metallisation, III-V wafers, ceramic substrates and comparable brittle materials can all be processed with ease.
“The combined benefits of highly precise scribing and breaking technologies are the driving forces behind this collaboration” Rick Slagle, Sales and Marketing Director of JPSA, said. “JPSA’s laser scribing systems deliver the narrowest kerf in the industry, 2.5 microns, at high speed, for maximum yields per wafer. DynTest brings advanced, precise breaking expertise to this relationship. The combined technology of JPSA and DynTest Technologies allows thicker material to be singulated accurately, meaning less scribing time, higher throughput and higher yields.”
“This provides the industry new opportunities for traceable device singulation in high volume manufacturing” support Joerg Lindner and Helge Luesebrink, Managing Directors of DynTest Technologies.
“Furthermore, these systems can break very small, relatively thick VCSEL and HB-LED dies” Slagle added. The result of the collaboration will mean excellent process speed and performance with improved yield rates. In addition to the quite sensitive epitaxial material of VCSELs and HB-LEDs, wafers with backside metallisation, III-V wafers, ceramic substrates and comparable brittle materials can all be processed with ease.
