News Article
Hynix Semiconductor announces closure of Eugene fabrication plant
The production of the fabrication plant will be eventually stopped by
end of September.
Because of short and long term market
conditions, which include a steep reduction in the price of memory
chips worldwide and accelerated technological migration towards next
generation production standards, Hynix Semiconductor has decided to
close its Eugene fabrication facility.
As part of the deliberations that led to this shut down, Hynix Semiconductor, the parent company of Hynix Semiconductor Manufacturing America, is seriously considering options to utilise our Eugene facilities after the closure. Options include pursuing a similar business to the current semiconductor operation; selling the equipment, building and land as a package to a third party semiconductor manufacturer; and selling the building and land separately from the equipment which will be relocated. As soon as decisions are finalised, the company will communicate plans to the Eugene community and Oregon government leaders.
Hynix Semiconductor has also reviewed various options in order to utilise other 200mm wafer fabrication plants located in Icheon and Cheongju, Korea. Some are planned either to produce consumer DRAM and System IC products or to provide foundry service. The remainder will be seriously considered to sell the equipment.
As part of the deliberations that led to this shut down, Hynix Semiconductor, the parent company of Hynix Semiconductor Manufacturing America, is seriously considering options to utilise our Eugene facilities after the closure. Options include pursuing a similar business to the current semiconductor operation; selling the equipment, building and land as a package to a third party semiconductor manufacturer; and selling the building and land separately from the equipment which will be relocated. As soon as decisions are finalised, the company will communicate plans to the Eugene community and Oregon government leaders.
Hynix Semiconductor has also reviewed various options in order to utilise other 200mm wafer fabrication plants located in Icheon and Cheongju, Korea. Some are planned either to produce consumer DRAM and System IC products or to provide foundry service. The remainder will be seriously considered to sell the equipment.
