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Thursday 15th May 2014
Technologists Achieve High Resist Sensitivity Targets, Potentially Easing EUV Source Power Requirements
Wednesday 14th May 2014
Toshiba and SanDisk Sign Memorandum of Understanding 
Monday 12th May 2014
Technologists at SEMATECH Successfully Reduce Defects from Multi-layer Deposition of Mask Blanks, Meeting the Defect Requirements for Early Introduction of EUV
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Friday 9th May 2014
The orders were secured by several major aerospace and defence customers
Friday 9th May 2014
Friday 9th May 2014
The film combines high glass transition temperature and stress absorption with thermal performance in die‐attach power dissipation
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Friday 9th May 2014
A new microscope could provide a process for stencilling patterns on silicon chips. The technique requires etching into the silicon through the spaces in the lithography stencil to transfer the pattern
Thursday 8th May 2014
The SIA says semiconductor sales reached $78.6 billion in the first quarter of 2014
Thursday 8th May 2014
The 55nm solution provides advanced technology and comprehensive design enablement support optimised to meet unique requirements of in-vehicle ICs
Thursday 8th May 2014
The ultra-low power additions expand the firm's products for wearable, mobile and energy-conscious applications
Thursday 8th May 2014
In collaboration with GlobalFoundries, Peregrine has completed product and process qualification for Its advanced RF SOI technology
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Thursday 8th May 2014
Combining Uniquify's IP and SK Hynix's memory components enables 2800Mbps, implemented using TSMC's 28HPM process technology
Wednesday 7th May 2014
The company believes it is reducing time to market with IP on its ONC18 process and helps reduce risk of design re-spins
Wednesday 7th May 2014
The firms will work together to develop high volume production processes and equipment necessary to bond the ultra-thin sapphire and SiC lamina to engineered substrates such as glass, silicon, and plastics

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