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Wednesday 19th February 2014
Cleverer management of the local memory banks known as ‘caches’ could improve computer chips’ performance while reducing their energy consumption
Tuesday 18th February 2014
  The new facility will support partners and accelerate development of next generation Envelope Tracking solutions
Tuesday 18th February 2014
As the demand marches on, shipments in excess of one trillion units will be the new “normal” from 2016
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Tuesday 18th February 2014
This marks a step in demonstrating the capability of Gigaphoton’s most advanced high-power GT64A light source for high volume production in 450mm lithography processes
Tuesday 18th February 2014
The patent which ITC has issued against relates to internet integrated circuit probe cards
Monday 17th February 2014
This milestone moves the lithography industry closer to production-level LPP EUV light sources
Monday 17th February 2014
Silicon nanoparticles encased in carbon and clustered like seeds in a pomegranate hold together and conduct electricity and minimise reactions with the battery’s electrolyte that can degrade performance
Monday 17th February 2014
Adoption of a SSOP16 package contributes to a reduction of assembly cost for small fan motors
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Friday 14th February 2014
The merger will create an independent spin out company that will focus on developing nanotechnology market opportunities
Thursday 13th February 2014
The versatile, highly integrated modules prolong battery life with new envelope tracking technology. They also simplify complex RF design for multi-band smartphones with a new mobile chip interface used by multiple chipset partners
Thursday 13th February 2014
The firms presented the ultra-wide-voltage range device at the International Solid-State Circuits Conference (ISSCC) 2014
Thursday 13th February 2014
The new company, BrPhotonics, is set to provide advanced High-Speed Components for Optical Communications utilising Silicon Photonics (SiPh) and Thin Film Polymer on Silicon Technologies. The aim is to advance 100Gbps to 1Tbps fibre-optic long haul, metro links and Cloud-connectivity in CFP2 and CFP4 applications
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Thursday 13th February 2014
The firm's customer has selected the Prim single-station chamber for advanced dielectric etcher production of 16nm Flash applications
Wednesday 12th February 2014
Wednesday 12th February 2014
The first NSX 320 metrology system has been sold specifically for Through Silicon Via (TSV) process development. It includes specialised sensors to measure critical parameters in 3D integration
Wednesday 12th February 2014

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