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Monday 17th February 2014
Silicon nanoparticles encased in carbon and clustered like seeds in a pomegranate hold together and conduct electricity and minimise reactions with the battery’s electrolyte that can degrade performance
Monday 17th February 2014
Adoption of a SSOP16 package contributes to a reduction of assembly cost for small fan motors
Friday 14th February 2014
The merger will create an independent spin out company that will focus on developing nanotechnology market opportunities
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Thursday 13th February 2014
The versatile, highly integrated modules prolong battery life with new envelope tracking technology. They also simplify complex RF design for multi-band smartphones with a new mobile chip interface used by multiple chipset partners
Thursday 13th February 2014
The firms presented the ultra-wide-voltage range device at the International Solid-State Circuits Conference (ISSCC) 2014
Thursday 13th February 2014
The new company, BrPhotonics, is set to provide advanced High-Speed Components for Optical Communications utilising Silicon Photonics (SiPh) and Thin Film Polymer on Silicon Technologies. The aim is to advance 100Gbps to 1Tbps fibre-optic long haul, metro links and Cloud-connectivity in CFP2 and CFP4 applications
Thursday 13th February 2014
The firm's customer has selected the Prim single-station chamber for advanced dielectric etcher production of 16nm Flash applications
Wednesday 12th February 2014
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Wednesday 12th February 2014
The first NSX 320 metrology system has been sold specifically for Through Silicon Via (TSV) process development. It includes specialised sensors to measure critical parameters in 3D integration
Wednesday 12th February 2014
Wednesday 12th February 2014
Wednesday 12th February 2014
The organisations demonstrated the chip at ISSCC2014. It signals an important achievement in enabling implantable cardiac monitoring solutions
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Wednesday 12th February 2014
At the 2014 IEEE International Solid-State Circuits Conference, the firm presented its XLL SRAM chip
Wednesday 12th February 2014
The firm's power conversion solution with multi-level pulsing enables exceptional Pplasma management for PECVD, PEALD, and advanced etch applications
Wednesday 12th February 2014
If it does, IC Insights believes it would be a win-win situation for both companies
Wednesday 12th February 2014
ASML Holding N.V., Canon Inc., Nikon Corp., and NuFlare Technology Inc. are the key vendors analysed in the report, "Global Lithography Systems Market 2014-2018"
Wednesday 12th February 2014
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