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Wednesday 28th August 2013
The aim is to create a solution to safely transfer and handle 3D IC wafers without the risk of breakage and other damage that may occur during the production process
Tuesday 27th August 2013
The transaction valued at up to approximately $1.6 billion including debt, will see Edwards' shareholders receive consideration of up to $10.50 per share in cash
Tuesday 27th August 2013
Reportlinker.com has a new market research report available in its catalogue called, "Global Automotive Sensors Market with Special Focus on MEMS Sensors"
Tuesday 27th August 2013
Engineers at Samsung and Osram claim that LEDs grown on silicon can deliver a performance that is very close to that of today's emitters
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Tuesday 27th August 2013
Two of the companies who will try to advance technology will be IBM and Intel who will help lead business and technical operations to expand capabilities and accelerate growth
Monday 26th August 2013
The facility will be used to manufacture NAND flash and 3D memories
Monday 26th August 2013
The Nexview profiler has 3D imaging and measurement system for rapid, precise, quantitative, and interactive surface metrology suited to semiconductor analysis
Friday 23rd August 2013
It looks like companies are investing in more semiconductor manufacturing equipment but this trend could easily change...
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Thursday 22nd August 2013
Wednesday 21st August 2013
The main reason for a delay in filing was down to the company reviewing the timing of the recognition of revenue and related expenses on the sale of some of its products
Tuesday 20th August 2013
The firm's recent advances in embedded wafer level packaging technology reduce bottom package height to less than 0.3mm for an overall PoP stack height of just 0.8mm
Monday 19th August 2013
A decline in foundry bookings was offset by growth in memory and logic orders and higher bookings in the Display Group and Applied Global Services in the last quarter. The company has also taken on a new CEO
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Wednesday 14th August 2013
Stifling the microprocessor market, it looks like PCs are on the way out
Wednesday 14th August 2013
The partnership is targeted at finding breakthrough solutions for semiconductor wafer level and interconnect packaging technologies

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