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Wednesday 13th June 2012
The firm says its new solution enables next-generation memory system design for high-performance computing, networking and test & measurement applications
Tuesday 12th June 2012
With this additional outsourcing, high-volume availability of ST’s proprietary FD-SOI technology speeds the way to higher performance and lower power consumption in next-generation mobile devices
Tuesday 12th June 2012
New embedded features are anticipated to more than double sensor sales by 2016, with accelerometers, gyros, and magnetic-field sensors leading market growth
Tuesday 12th June 2012
AMD, ARM, Imagination Technologies, MediaTek and Texas Instruments have formed the HSA Foundation to create a unified, open industry standard architecture to create heterogeneous processing. The aim is to integrate two or more different processor types Into a single chip
Tuesday 12th June 2012
The collaboration will also focus on low-power sensor circuit readout design, process technology, biosensors and wireless communication
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Saturday 9th June 2012
Global SiC Semiconductor Devices Market Worth $5.34 Billion by 2022
Thursday 7th June 2012
The Korean market is to continue to dominate, closely followed by the Americas and Taiwan
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Thursday 7th June 2012
Inventory held at the various points along the electronics supply chain has completed a 2011 correction, and companies are again re-stocking to meet anticipated demand in the second half of 2012
Thursday 7th June 2012
While Denso, Sensata and Panasonic all experienced increased annual revenues in the sector in 2011, Freescale sales remained practically flat from 2010
Thursday 7th June 2012
Future Horizons has announced details of EU report on 450mm transitions with a positive take on 450mm future
Thursday 7th June 2012
Gregg Lowe Named President and CEO of Freescale Semiconductor
Wednesday 6th June 2012
Although only a slight increase in global sales is predicted in 2012, the industry should experience more robust growth in 2013 and 2014
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Wednesday 6th June 2012
The new Applied Varian VIISta Trident system delivers precise dose and angle control needed in advanced semiconductor transistors
Tuesday 5th June 2012
Growing three times faster than the overall IC packaging industry, the MEMS packaging, assembly, test & and calibration market is predicted to hit $2.3 billion value by 2016 Mainbody:

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