Rudolph Receives System Order Over $11 Million
Rudolph Technologies, a provider of design, development, manufacture and support of defect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide, announced today that a leading OSAT in Asia has placed an order for over $11 million USD for an integrated solution consisting of multiple process control inspection systems and yield management software suite. The solutions will be deployed into multiple applications including whole wafer inspection, 3D bump metrology and post-saw die inspection. The systems will begin shipping in Q2 2016, with the majority of the order shipping the second half of 2016.
"We are pleased with this order and the confirmation of Rudolph Technologies' fan-out wafer level packaging (FOWLP) solution portfolio," said Mike Goodrich, vice president and general manager of Rudolph's Process Control Group Business Unit. "Key factors of this win were the systems' unique FOWLP process control capabilities including superior defect capture and identification rate, combination 2D+3D metrology and flexible wafer automation solutions. All systems will be equipped with Rudolph's Discover® Yield Management Software and TrueADC Classification software that enhances the user's process analysis capability, enabling our customers to make targeted data-driven decisions increasing the total productivity of the overall fab."
"FOWLP is growing rapidly, and to facilitate that growth Rudolph has focused on integrating technologies into solutions for monitoring and characterizing manufacturing lines particularly in the areas of bump processing as well as die singulation quality control," said Mike Plisinski, chief executive officer of Rudolph. "This continued investment by a leader in FOWLP underscores the importance of our solutions and the compelling value they provide. This investment is further confirmation of the advanced packaging sector's growth rate as our industry continues the transition towards cost effective, high performance packaging solutions."
The NSX Series inspection system product family is the market leader for automated macro defect inspection and metrology for advanced packaging manufacturing. The NSX 330 Series is a proven enabler of advanced packaging processes, by directly improving the cost-of-ownership with its capability to address multiple process steps in a single platform. The NSX 330 Series boasts flexible handling and sensor options, that when combined with advanced process management software capabilities, provides users with an unprecedented level of process control solutions.
Discover YMS Software is Rudolph's in-line defect, metrology and data management system designed to enhance Rudolph's process analysis capability in real-time and post inspection analysis. While inspection and metrology systems provide a snapshot of the wafer or lots, limiting process correlation to a single event, Discover software collects individual tool results and provides an advanced statistical analysis of those results, allowing users to drill down into the data to reveal defect and metrology trends, wafer-level signatures, defect source analysis and metrology correlations. Discover software offers full characterization of inspection data, resulting in high productivity and demonstrable quality improvements.
TrueADC software is Rudolph's automatic defect classification software designed to automatically categorize defects detected by the NSX systems according to the defect's attributes, enabling quick, consistent, and accurate classification without assistance from human operators. Accurate classification of the defect type is critical for users to identify root causes of process excursions.
