In a short statement 3M and the EV Group (EVG) have agreed to settle a patent infringement litigation brought by EVG against 3M in the U.S. District Court of the Southern District of New York relating to systems for temporary wafer bonding.
SPIE Advanced Lithography, the annual forum of the lithography community, will bring worldwide experts working in EUV, smart metrology, resist materials, processing technology, and other established and emerging topics to the 34th event next February in San Jose.
Applied Materials announced that its North American employees have raised more than $480,000 for local food banks in the past two months through a variety of fundraising activities, exceeding the company’s 2008 fundraising goal.
The news of late has not being inspiring so it was a pleasure that EuroAsia Semiconductor received Bill McLean’s latest monthly report providing a realistic look at what is likely to happen in 2009 and finds that it has been worse.
Wet wafer surface preparation equipment provider SEZ, now part of the LAM group, has confirmed that another 60 jobs will be lost. The arbitration commission of the Austrian county of Kärnten heavily criticised the redundancy packages the company is offering.
Following a dismal 2008, global spending on semiconductor manufacturing equipment in 2009 will fall to its lowest level in six years, due to weakening conditions in the chip and electronic equipment markets, according to iSuppli Corp.
The company deploys the next phase of step and flash imprint lithography (S-FIL) campaign across multiple industries. HDD industry standardising on S-FIL and semiconductor industry moving toward adoption.