2.5D/3D packaging panel at the GSA Silicon Summit
eSilicon's senior director of engineering, eSilicon Corporation, Javier DeLaCruz will moderate the 2.5D/3D packaging panel at the GSA Silicon Summit.
The discussion will take place on April 10th, 2014 from 1.15 to 2.15 pm at the Computer History Museum, Mountain View in California. The name of the discussion is, "Enabling a 2.5D/3D Ecosystem".
Panelists:
Calvin Cheung, VP of engineering, ASE U.S.
Bob Patti, CTO & VP of design engineering, Tezzaron
Riko Radojcic, director, advanced technology engineering, Qualcomm Incorporated
Arif Rahman, program director & architect, Altera Corporation
Brandon Wang, director, 3D-IC solutions, Silicon Realisation Group, Cadence Design Systems, Inc.
Abstract: 2.5 & 3D package technology holds great promise for enabling heterogeneous integration and reducing design complexity. The keynote address will provide an overview on where the industry stands in terms of developing and commercialising 2.5D/3D semiconductor technology and what remains to be done.
A panel discussion will follow and address the use case for 2.5D/3D package technology, as well as the business needs within the supply chain in order to ignite 2.5D/3D package technology adoption and market growth, changing it, if possible, from a nascent alternative to a mature option.
Javier DeLaCruz is the senior director of engineering at eSilicon Corporation. He is responsible for foundry, packaging, signal integrity, product and test engineering. He has also led eSilicon's 2.5D and 3D MoZAIC package system initiatives.
DeLaCruz has over seventeen years of experience in semiconductor packaging and is a senior member of IEEE. He has extensive knowledge in analogue design, high-speed digital design, thermal and electrical simulation, and package assembly.
eSilicon delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production.