SUSS MicroTec reveals mask aligner for 200mm
The tool is designed for high volume manufacturing and can be used for exposing wafers with a diameter of up to 200 mm.
This latest generation tool is a further development of the MA200 Compact platform, of which the 100th tool was recently delivered to a customer.
The MA200 Gen3 combines the SUSS MicroTec Mask Aligner technology with several new features, which render it one of the leading exposure systems in the areas of advanced packaging and MEMS. Special application fields are exposure processes with thick photo resists for advanced packaging, wafer level packaging and 3D integration as well as the production of MEMS.
The third tool generation incorporates an improved throughput as well as a better process administration and -definition. The new features lead to an overall improved cost of ownership.
"Our well established Mask Aligner technology is upgraded regularly to meet the latest technological challenges and is constantly developed further to address the future demands of exposure applications.", says Frank P. Averdung, President and CEO of SUSS MicroTec. "The advantages of the MA200 Gen3 are a high throughput of 140 200 mm wafers per hour coupled with very good process reliability."
