Signetics still enhancing flip chip capacity
The firm has begun development of a new Bond on Finger (BOF) technology
In 2013, Signetics saw the growing demand for flip chip assembly capacity and responded by increasing capacity by more than 35 percent over the previous year. There has so far been no slowdown in demand in 2014.
To ensure Sinetics is ready for this jump, the company has grown its flip chip capacity by 100 percent over 2013 to a total of eight Flip Chip assembly lines. By the end of 2014, the plan is to bring the number of Flip Chip assembly lines to nine.
A new assembly process technology on our 2014 flip chip package roadmap is the introduction of Bond on Finger (BOF). BOF technology allows for greater design flexibility and can help reduce the overall assembly cost.
Signetics recently completed the qualification of its Grinding After Laser die singulation process. This process is claimed to be better for thin wafer handling and ensures that there will be no die chipping or die attach film burrs. This also allows a narrower scribe line, as small as 10µm.
