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Friday 24th October 2008
Successful in action: SESAM high performance microscope from Carl Zeiss in the Stuttgart Centre for Electron Microscopy of the Max-Planck-Institute for metals research. Carl Zeiss also received the EuroAsia IC Industry Awards Subsystems/Components Improvement in October this year for the Libra 200 MC.
Friday 24th October 2008
The company draws $460 million under its revolving credit agreement.
Thursday 23rd October 2008
The foundry successfully developed 0.11 Micron CIS process technology.
Thursday 23rd October 2008
Ultra thin chip fabrication capability will be a key enabler in future microelectronics and microsystems applications, such as three dimensional integrated circuits (3D IC) and systems in foil (SiF).
Thursday 23rd October 2008
Advanced Micro Fabrication Equipment (AMEC), an Asia based semiconductor equipment maker and this year's EuroAsia IC Industry Award's Start Up of the Year recipient, secured $58 million in Series C financing.
Thursday 23rd October 2008
The company aims to ramp up its Femtocell production.
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Wednesday 22nd October 2008
The funding comes from from Intel Capital and current investors. The company aims to expand global sales and marketing and grow the HiveGo solution portfolio for mobile phones and mobile internet devices.
Wednesday 22nd October 2008
Solvay joins Holst Centre research programme on systems in foil (SIF).
Wednesday 22nd October 2008
The company receives two IC Industry Awards from EuroAsia Semiconductor.
Wednesday 22nd October 2008
The company issues a statement with regard to the withdrawal of proposal from Samsung.
Wednesday 22nd October 2008
New investment to enhance customer support and spur growth.
Wednesday 22nd October 2008
The company aims to enhance its portfolio of motion control and manufacturing process.
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Wednesday 22nd October 2008
Oxford Instruments - TDI develops new technique for HVPE growth of InGaN.
Tuesday 21st October 2008
The company notes a positive operational cash flow in Q3.
Tuesday 21st October 2008
Fairchild Semiconductor and Alpha & Omega Semiconductor resolve patent dispute.
Tuesday 21st October 2008
The project involves Sun Microsystems and DARPA and silicon technology is selected to develop next generation optical interconnects.
Tuesday 21st October 2008
Prime Technology Ventures (PTV) and Philips to arrange for successful spin out of INTRINSIC-ID.
Tuesday 21st October 2008
The company celebrates the grand opening of its global pads manufacturing centre.
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Tuesday 21st October 2008
The photomask manufacturer announces its re-organisation of European manufacturing network and estimates that approximately 85 jobs will be affected.
Monday 20th October 2008
The companies reallocate NAND flash memory JV production capacity. Toshiba to increase its production capacity, quickly at a lower cost.
Monday 20th October 2008
The company plans a new production plant with an annual capacity of 10,000 metric tons and expects to create approximately 450 new jobs.
Monday 20th October 2008
The company receives next generation order for Suprema photoresist system from leading global semiconductor manufacturer.
Monday 20th October 2008
The company appoints Digital China as principal distributor to significantly expand sales coverage in growth market.
Monday 20th October 2008
Small business innovation research phase III contract is for wideband sensor systems.

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