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Wednesday 2nd July 2008
Henkel and leading Shanghai region academia form joint electronics research and failure analysis centre.
Wednesday 2nd July 2008
USDC and Applied Materials collaborate to develop advanced films for next generation display products.
Wednesday 2nd July 2008
40-30 helps CERN build world’s most powerful particle accelerator
Tuesday 1st July 2008
This acquisition will extend Virage Logic’s market position and enables Impinj to focus on RFID business.
Tuesday 1st July 2008
To Expand Business in China, Renesas will establish a unified operation in China by merging sales subsidiaries and technical support subsidiaries.
Monday 30th June 2008
Chip sales up 2.8 % from April. Worldwide chip sales Up 7.5 % in May.
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Friday 27th June 2008
M + W Zander builds semiconductor factory for ANGSTREM-T in Russia
Friday 27th June 2008
M + W Zander builds semiconductor factory for ANGSTREM-T in Russia
Friday 27th June 2008
Both companies name their joint venture ST-NXP Wireless, introduce the new management team and prepare to enter global market Q3 2008.
Thursday 26th June 2008
The partnership will provide complete solar cell manufacturing lines. Solar cell manufacturing equipment will be installed at SVTC Solar’s new Silicon Valley Photovoltaic Development Centre.
Thursday 26th June 2008
Oral ruling returns the proceedings to the Korean Patent Court with instructions to revisit the prior decision holding the claims of FormFactor's Korea Patent No. 252457 valid.
Thursday 26th June 2008
Carl Zeiss designates SCHOTT Lithotec as a Supply Chain Partner
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Thursday 26th June 2008
The financial concerns affecting the semiconductor industry have hit Austrian company, SEZ, with at least 80 jobs to go at the company, mainly in the Austrian operations. EuroAsia Semiconductor spoke to Kurt Lackenbucher, Executive VP & Chief Operating Officer who confirmed that the job losses will go ahead.
Tuesday 24th June 2008
New specifications cover FPD, MEMS and semiconductor industries to address critical manufacturing challenges
Monday 23rd June 2008
Toppan Printing enters into new photomask process development agreement with IBM. New collaboration to include early establishment of 22nm photomask process
Monday 23rd June 2008
The two competitors merge to combine their strength in technical expertise and expand their product portfolio.
Monday 23rd June 2008
BSK & TECH announces initial $1.8M 3D chip order with LCD panel supplier KDC
Friday 20th June 2008
The companies, using twisted direct silicon bonding, achieved higher hole mobility for future generation CMOS technology.
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Friday 20th June 2008
A research team at the University of Michigan has developed a low power chip that dramatically uses less power than comparable chips on the market. At 30pW it uses about 30,000 less power in sleep mode.
Friday 20th June 2008
The newly commissioned plant of joint venture Siltronic Samsung Wafer Pte has started operation for its 300mm wafer production with a target of 300,000 wafers a month.
Friday 20th June 2008
Stanford University researchers, supported by the Semiconductor Research Corporation (SRC) overcome mispositioned carbon nanotubes to create logic circuits at wafer scale. Unruly CNTs are tamed, full wafer scale growth is demonstrated, viable commercial use in reach.
Thursday 19th June 2008
The design of a security application integrated chip using 65 nm technology will strengthen Dubai’s position on the international IC design map withthe contribution of the DSO
Wednesday 18th June 2008
Mentor Graphics is reluctant to accept a $1.6 billion proposal from Cadence Design Systems even at a 30% premium offer.
Wednesday 18th June 2008
The research company reports progress on simplified high-k/metal gate process for the 32nm node

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