The slow down of DRAM manufacturing continues to impact on company orders. In the third quarter 2007, the SEZ Group have announced a preliminary order intake of 48 million Swiss Francs (CHF)-26 percent below its expectations due to the absence of expected orders from the DRAM memory segment, which is still under pricing pressures.
Flash vendor, Silicon Storage Technology Inc (SST) and Insyde Software Corp, a leading provider of UEFI-based firmware, BIOS and engineering services, have announced the joint development of FlashMate technology, enabling new usage models to notebook PC consumers that will revolutionise their portable computing experience.
NXP Semiconductors, the independent company founded by Philips, has announced that Hi-Tech Wealth (HTW) has selected its Nexperia Cellular System Solution 5110 for the world’s first commercial solar-powered mobile phone, S116.
STATS ChipPAC Ltd, an independent semiconductor test and advanced packaging service provider, has announced that it has completed the acquisition of LSI Corporation's assembly and test operation in Pathumthani, Thailand.
Researchers at the Fraunhofer Institute for Laser Technology ILT have developed a non-contact soldering system in which the temperature is constantly monitored. If the temperature deviates beyond set limits, the system automatically adjusts it to an acceptable value.
American Air Liquide Holdings, Inc, has announced an agreement to purchase the assets of Scott Specialty Gases, Inc, a leading privately held international producer and supplier of value-added mixed and pure high specialty gases.
The Korean Times has written that Hynix Semiconductor will raise the portion of the over 1-gigabit dynamic random access memory (DRAM) chips to 60% of its total DRAM output by the end of the year, to produce more profitable advanced chips.
Metrosol Incorporated, a developer, manufacturer and worldwide supplier of short wavelength optical metrology solutions, and SEMATECH, the global consortium of leading chipmakers, have demonstrated their inline optical metrology for high-k gate dielectric composition, thickness, and most importantly, ultra-thin interfacial layer thickness.
C-MAC MicroTechnology and Danfoss Silicon Power have announced a strategic partnership to co-develop and manufacture intelligent, compact power modules targeted at the rapidly growing automotive sector.