It has been reported that chip makers are exploring a move to bigger silicon wafers to boost efficiency and help them grab market share as demand for gadgets from music players to cameras surges, but only if someone foots the multi-billion dollar price tag.
STMicroelectronics, a semiconductor manufacturer and a supplier of silicon chips for wireless applications, has announced that it has successfully manufactured the first functional devices to be built using the CMOS 45nm Radio Frequency (RF) technology. This leading-edge technology will be essential for next-generation WLAN (Wireless Local Area Network) applications.
STATS ChipPAC Limited, an independent semiconductor test and advanced packaging service provider, has announced it has expanded the production floor in its Ulu Klang Free Trade Zone plant in Kuala Lumpur, Malaysia.
Dow Corning Compound Semiconductor Solutions (DCCSS) has been awarded a US$4.2 million contract from the U.S. Office of Naval Research to develop semiconductor silicon carbide (SiC) materials technology.
INFICON, a leading manufacturer of instrumentation and process control software for the semiconductor and vacuum-coating industries and other industrial applications, today announced it has acquired Sigma Instruments Inc., a leading manufacturer of instrumentation for the measurement and control of thin film processes.
Polymer Vision, a spin out of Royal Philips Electronics, has announced first production level rollable displays from its recently acquired manufacturing facility, Polymer Vision (UK) Ltd in Southampton, England.
JSR Micro Incorporated, the US operations of JSR Corporation of Tokyo, Japan, have announced that it has entered a joint research agreement with IBM to explore new technologies for emerging semiconductor materials and processes.
Nova Measuring Instruments Limited, a provider of stand-alone metrology and of integrated metrology solutions to the semiconductor process control market, announced that a major top 10 semiconductor memory manufacturer has selected the NovaScan platform as its integrated metrology solution for CMP process control in all manufacturing facilities in Korea and China.
EV Group, a supplier of wafer-bonding and lithography equipment for the MEMS and nanotech markets, and Brewer Science Incorporated, a developer of semiconductor technology, have claimed a ‘milestone’ in handling and processing of ultrathin wafers.
The U.S. Department of Energy (DOE) has awarded Xidex Corporation, an Austin, Texas based nanotechnology company a contract for scaleable manufacturing of carbon nanotube (CNT) based field emission sources for use in scanning electron beam instruments such as scanning electron microscopes (SEMs) and transmission electron microscopes (TEMs).
EV Group, a supplier of wafer-bonding and lithography equipment for the MEMS and nanotech markets, and Brewer Science Incorporated, a developer of semiconductor technology, have claimed a ‘milestone' in handling and processing of ultrathin wafers.
KLA-Tencor Incorporated and Nikon Corporation have collaborated to develop a set of fully automated overlay correction control system tools, called Scanner Match Maker (SMM), that chipmakers can use to correct overlay errors common to ‘mix and match' lithography strategies which use lithography tools of varying capabilities and from different suppliers.
M+W Zander (Shanghai) Company Limited, China, has been awarded a new major contract for design and construction of the most advanced semiconductor factory in China. The company of the M+W Zander Group was appointed as general contractor for engineering, procurement and construction.