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Friday 14th September 2007
STMicroelectronics has announced a new family of secure microcontrollers based on a 0.13-micron state-of-the-art process technology, which are intended for banking, loyalty card and other financial applications.
Friday 14th September 2007
MAPPER Lithography has reached an important milestone in the development of its highly innovative lithography machine for advanced chip manufacturing.
Wednesday 12th September 2007
SUSS MicroTec have announced it has received the first order for its new Gamma XPress coat / develop cluster from Rohm and Haas Electronics Materials.
Wednesday 12th September 2007
ASML have announced that a Taiwanese customer using its TWINSCAN i-Line scanners has achieved an unprecedented level of 300mm productivity by processing 150 wafers per hour for 24 hours, reaching a record output of 3,596 wafers in a single day.
Tuesday 11th September 2007
Aviza Technology have announced that the Company has entered into a joint development program (JDP) with Mosel Vitelic Corporation (MVC). As part of this collaboration, Aviza and MVC will jointly develop advanced atomic layer deposition (ALD) materials for next-generation Flash applications.
Tuesday 11th September 2007
ATMI and Intermolecular have announced that ATMI has purchased Intermolecular's complete Tempus Fluids-based High-Productivity Combinatorial (HPC) workflow for accelerated research and development (R&D).
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Tuesday 11th September 2007
iSuppli Corp.'s final estimate of microprocessor market share in the second quarter reveals Advanced Micro Devices Inc. (AMD) made greater gains than originally thought.
Monday 10th September 2007
Infineon Technologies have announced it is the sole chip supplier for the largest patient healthcare card in United States. Siemens, Mount Sinai Medical Center and Elmhurst Hospital Center have formed a health smart card alliance to deploy up to 1.2 million Patient Health Smart Cards to link as many as 45 affiliated and related medical facilities in the New York metro area.
Monday 10th September 2007
Intel has broken ground on its first 300mm wafer fabrication facility in Asia. The new factory, named Fab 68, will extend Intel's manufacturing leadership, while helping cultivate engineering talent, accelerate the growth of China's information technology (IT) ecosystem, and bring Intel's culture of environmental leadership to China.
Monday 10th September 2007
The highest-resolution images ever seen in (S)TEM electron microscopy have been recorded using a new instrument developed jointly by U.S. Department of Energy national laboratories, FEI Company (Nasdaq: FEIC) and CEOS GmbH, in Heidelberg, Germany.
Monday 10th September 2007
AMD has introduced the Quad-Core AMD Opteron processor, the most advanced x86 processor designed and manufactured so far and the first native x86 quad-core microprocessor.
Monday 10th September 2007
Consumers of semiconductors often rely on the metric given as a specification to decide their purchase as they believe the metric tells them useful information regarding the semiconductor.
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Monday 10th September 2007
Semiconductor Manufacturing International Corp. (SMIC), China's biggest chipmaker, said a U.S. court denied a preliminary injunction against it by Taiwan Semiconductor Manufacturing Co. on Sept. 7.
Thursday 6th September 2007
Micronic Laser Systems, has received an order for two pattern generators for the production of display photomasks from a customer in Japan.
Thursday 6th September 2007
Fairchild Semiconductor has announced that it has closed a transaction to sell selected assets of its RF Group to ANADIGICS, Inc.
Thursday 6th September 2007
Praxair, Inc. has started up a new air separation plant with a capacity of 1,300 tons per day to supply Samsung Electronics' advanced thin-film-transistor, liquid-crystal-display (TFT-LCD) factory in Tangjeong, South Korea.
Wednesday 5th September 2007
OKI Printing Solutions and Dalian Polytechnic have announced their partnership to develop paper using annual plants, instead of wooden-based paper. Leveraging their strengths, the forest-saving paper developed and manufactured will be of high quality, ideal for colour printers.
Wednesday 5th September 2007
Toshiba Corporation and SanDisk Corporation have celebrated the opening of Fab 4, the latest 300mm wafer fabrication facility at Toshiba's Yokkaichi Operations in Japan.
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Wednesday 5th September 2007
Edwards has announced the sale of multiple exhaust abatement systems to Advent Solar, Inc. Edwards Hot Oxidation Systems (HOx) will be used by Advent Solar for abatement of PECVD exhaust gases during solar cell manufacturing at its New Mexico plant.
Wednesday 5th September 2007
Semi Scenic has secured a contract worth more than $1 million dollars to supply essential components to the UK's flagship micro and nanotechnology project based in Scotland.
Wednesday 5th September 2007
Rudolph Technologies has announced that it has provided an edge inspection tool to lithography system provider ASML Holding NV (ASML) to help characterize wafer defects originating from process control issues at the wafer edge and accentuated by the immersion lithography process.
Tuesday 4th September 2007
DRAM memories price developments and their impact on the European market are still under the spotlight, and a positive result is reported in July over June.
Tuesday 4th September 2007
Every irregularity no matter how small must disappear: Polishing silicon wafers for solar cells and computer chips demands the greatest precision.
Tuesday 4th September 2007
SUSS MicroTec and Surface Technology Systems have announced that the successful 'MEMS Roadshow', which toured 5 cities in the US earlier this year, will now travel to Europe.

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