ChipSensors Ltd, a fabless semiconductor start-up company, has unveiled a breakthrough in semiconductor technology enabling the surface of the chip itself to sense parameters such as temperature, humidity, certain gases and pathogens.
Sigma-Aldrich has announced its intent to invest in a site at the Wuxi-New District Park (WND) located northwest of Shanghai, China, for its new Asia-Pacific manufacturing hub. Sigma-Aldrich has executed a memorandum of understanding with the WND authorities.
Rohm and Haas Electronic Materials have introduced the EcoVision 4000 ultra-low defectivity performance CMP pad designed specifically for advanced copper barrier processes for 45 nm technology nodes and beyond.
STMicroelectronics has announced a new family of secure microcontrollers based on a 0.13-micron state-of-the-art process technology, which are intended for banking, loyalty card and other financial applications.
ASML have announced that a Taiwanese customer using its TWINSCAN i-Line scanners has achieved an unprecedented level of 300mm productivity by processing 150 wafers per hour for 24 hours, reaching a record output of 3,596 wafers in a single day.
Aviza Technology have announced that the Company has entered into a joint development program (JDP) with Mosel Vitelic Corporation (MVC). As part of this collaboration, Aviza and MVC will jointly develop advanced atomic layer deposition (ALD) materials for next-generation Flash applications.
ATMI and Intermolecular have announced that ATMI has purchased Intermolecular's complete Tempus Fluids-based High-Productivity Combinatorial (HPC) workflow for accelerated research and development (R&D).
Infineon Technologies have announced it is the sole chip supplier for the largest patient healthcare card in United States. Siemens, Mount Sinai Medical Center and Elmhurst Hospital Center have formed a health smart card alliance to deploy up to 1.2 million Patient Health Smart Cards to link as many as 45 affiliated and related medical facilities in the New York metro area.
Intel has broken ground on its first 300mm wafer fabrication facility in Asia. The new factory, named Fab 68, will extend Intel's manufacturing leadership, while helping cultivate engineering talent, accelerate the growth of China's information technology (IT) ecosystem, and bring Intel's culture of environmental leadership to China.
The highest-resolution images ever seen in (S)TEM electron microscopy have been recorded using a new instrument developed jointly by U.S. Department of Energy national laboratories, FEI Company (Nasdaq: FEIC) and CEOS GmbH, in Heidelberg, Germany.