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Tuesday 13th November 2007
Infineon Technologies, a supplier of semiconductor and system solutions, and Advanced Semiconductor Engineering Incorporated (ASE), a semiconductor packaging and test company, have announced a partnership to introduce semiconductor packages with a higher integration level of package size with an almost infinite number of contact elements.
Tuesday 13th November 2007
Greenlight Energy Resources, an operator of renewable energy projects and an investor in early stage renewable energy companies, Avista Corporation, and several other investors have put US$10 million in Series A funding in GreenVolts, a leader in high concentrating photovoltaic technology and wholesale distributed energy.
Tuesday 13th November 2007
Infineon Technologies AG has announced a strategic technology collaboration for the development of optimised chip solutions for high-density (HD) SIM cards with Intel Corporation.
Tuesday 13th November 2007
S.E.T. (former SUSS MicroTec Device Bonder Division), a supplier of high accuracy die-to-die, die-to-wafer bonding and nanoimprint lithography solutions has announced that the partnership between S.E.T. and CEA Leti has resulted in a radically new generation high accuracy (0.5 µm), high force (4,000 N) device bonder for wafer diameters up to 300 mm. It includes a built-in chamber for collective reflow in a gas or vacuum environment. The system also features nanoimprinting capabilities.
Monday 12th November 2007
Intel Corporation has announced that it will introduce its newest generation of microprocessors, with a sophisticated new approach that crams up to 40% more transistors onto a chip.
Monday 12th November 2007
Aquest Systems, a developer of innovative automation solutions for the global semiconductor industry, has announced the availability of its new FabEX ;No-Wait-ProductivitySM Improvement (NPI) solution.
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Monday 12th November 2007
The IBM-led Common Platform alliance plans to increase its investment in semiconductor packaging technology to pave the way to 32nm devices.
Monday 12th November 2007
BASF has opened its new Electronic Materials Centre Europe in Ludwigshafen, Germany
Friday 9th November 2007
It has been reported PC microprocessor shipments worldwide grew 14.3% sequentially to reach record levels in the third calendar quarter of 2007 (3Q07), according to IDC researchers. Consequently, worldwide PC microprocessor revenue rose 14.8% to US$7.95 billion in the quarter.
Friday 9th November 2007
Chipmaker, ON Semiconductor Corporation, has announced that it has signed an agreement to acquire voltage regulation and thermal monitoring products for computing applications from Analog Devices Incorporated (ADI).
Friday 9th November 2007
According to Jin Seog Choi, chief technology officer at Hynix Semiconductor Incorporated, Korea, Lithography is among the top productivity challenges facing the semiconductor industry, but packaging and testing costs are another area that must be addressed
Friday 9th November 2007
Nanometrics Incorporated, a supplier of advanced metrology equipment to the semiconductor industry, has announced that AIXTRON AG, a provider of deposition tools used in the worldwide production of advanced components for electronic and opto-electronic applications, has purchased the Nanometrics VerteX photoluminescence (PL) mapping system to determine material composition, measure layer thickness and improve the wafer uniformity performance of its equipment.
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Thursday 8th November 2007
First Solar, Incorporated of Phoenix, AZ, USA has announced that it has entered into new long term module supply agreements with a subsidiary of international investment and funds and asset manager Babcock & Brown in Australia and Ecostream Switzerland GmbH, a subsidiary of Econcern BV, which focuses on developing solutions for sustainable energy supply.
Thursday 8th November 2007
Wolfgang Ziebart, chairman of the board at Infineon Technologies AG, has stated that Germany will only be able to remain a prime site for the microelectronics industry if it changes its economic policies.
Thursday 8th November 2007
Rudolph Technologies Incorporated, has announced the launch and first shipments of its new Transparent Thin Film Metrology System.
Thursday 8th November 2007
The Secretary of State for Innovation, Universities and Skills, John Denham, has announced that the Technology Strategy Board will invest a further £100m in innovation, and invited businesses to submit proposals for collaborative research and development in innovation and new technology.
Thursday 8th November 2007
The Secretary of State for Innovation, Universities and Skills, John Denham, has announced that the Technology Strategy Board will invest a further £100m in innovation, and invited businesses to submit proposals for collaborative research and development in innovation and new technology.
Thursday 8th November 2007
It has been reported that in an effort to diversify and expand its business, Peak International has started selling 300mm wafer shippers and is expected to bring to market several more versions in 2008. The company has secured its first customer for its ‘UltraCare' wafer shipper and has built a new dedicated cleanroom to ramp production with a third cleanroom already under construction, the company said.
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Thursday 8th November 2007
Synopsys Incorporated, a leader in software and IP for semiconductor design and manufacturing, and the semiconductor foundry, UMC, have announced the release of a 65-nanometer (nm) hierarchical, multi-voltage RTL-to-GDSII reference design flow.
Thursday 8th November 2007
Sony Corporation has announced that it is withdrawing from a joint research project with IBM and Toshiba to develop the production of microchips with a circuitry of 32-nanometres or less.
Thursday 8th November 2007
Tokyo Electron Limited (TEL) has become the first semiconductor supplier company to join SEMATECH's 3D interconnect programme, teaming with several leading;chip-makers who are the programmme's founding members.
Thursday 8th November 2007
Agilent Technologies Incorporated and Velocity11 have announced that they have signed an agreement for Agilent to acquire Velocity11.
Wednesday 7th November 2007
It has been reported that SAFC Hitech has followed up on a previous announcement made in September 2007, when it said it would invest in a facility at the Wuxi-New District Park to make specialty electronic chemicals to meet the growing worldwide demand for its products, with news that further expansions may soon be made that now include South Korea.
Wednesday 7th November 2007
Credence Systems, a provider of test and analytical solutions from design to production for the semiconductor industry, has announced additions to its range of integrated analytical tools designed to meet the complex challenges facing manufacturers of today's advanced 65nm, 45nm and beyond device technologies.

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