KLA-Tencor Incorporated and Nikon Corporation have collaborated to develop a set of fully automated overlay correction control system tools, called Scanner Match Maker (SMM), that chipmakers can use to correct overlay errors common to ‘mix and match' lithography strategies which use lithography tools of varying capabilities and from different suppliers.
M+W Zander (Shanghai) Company Limited, China, has been awarded a new major contract for design and construction of the most advanced semiconductor factory in China. The company of the M+W Zander Group was appointed as general contractor for engineering, procurement and construction.
Novellus Systems Incorporated has announced that it has qualified several companies as licensed partners to support customers for manufacturing, service and spare parts of its refurbished and Classic equipment.
ATMI, Incorporated has announced it has entered into an agreement with IBM to jointly develop and demonstrate advanced chemical formulations for highly implanted photoresist strip applications that will allow the design and production of next-generation semiconductor devices targeting 45-nanometer and future device manufacturing processes.
Samsung Electronics Company Limited and Toshiba Corporation have announced that they have licensed to one another the rights to produce, market and sell memory with the specifications and trademarks of Samsung's OneNAND and Toshiba's LBA-NAND memory chips.
The leading manufacturers of semiconductor equipment project 2007 sales are to reach US$41.68 billion according to the year-end edition of the SEMI Capital Equipment Consensus Forecast, released by SEMI at the annual SEMICON Japan exposition.
ATDF and SVTC Technologies have announced a merger that could change the landscape for semiconductor and nanotechnology development by expanding secure, cost-effective access to advanced process tools and capabilities for a wide range of technology companies.
Aviza Technology Incorporated, a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, has reported results for the fourth quarter and year-end of fiscal year 2007.
Cymer Incorporated, a supplier of excimer laser light sources used in semiconductor manufacturing, announced the company reached its goal of demonstrating 100 watts of extreme ultraviolet (EUV) burst power at the 2007 International EUVL Symposium held recently in Sapporo, Japan.
Semilab Co. Limited and SSM Incorporation, both manufacturers of materials metrology solutions to the semiconductor and solar industries, have announced that they have jointly signed a letter of intent whereby Semilab will acquire SSM.
Semiconductor sales in Europe grew faster than the worldwide market in October according to the World Semiconductor Trade Statistics (WSTS) organisation. This is the fourth successive month where the European market exhibited growth.
Intel Corporation and Advanced Micro Devices Incorporated (AMD) in the third quarter (Q3) both managed to gain share in the global microprocessor market due to robust sales of PCs and servers and the cessation of the companies' price war, according to iSuppli Corporations's final ranking.
Taiwan Semiconductor Manufacturing Company Limited has announced that it has shipped its one-millionth 12-inch 90-nanometer (nm) wafer in record time. The record was reached in just 53 months, surpassing the 58 months it took the 0.13-micron process to reach that milestone.
Tokyo Ohka Kogyo Company Limited (TOK) and Dow Corning Electronics have announced that their new, jointly developed bilayer photoresist is being used in production for the first time by a leading manufacturer of DRAM chips.
In an ironic twist of fate, a slowdown in semiconductor production and an associated drop in demand for silicon wafers will ease the shortage of polysilicon used for solar cell production and impact manufacturers as well as equipment suppliers according to a report by The Information Network.
Trina Solar has announced that it has successfully reached 100% commercial production of 200 micron thickness wafers, down from the previously used 220 micron thickness as the company attempts to improve silicon usage and lower manufacturing costs.
Amid strong growth in global NAND flash memory sales in the third quarter, Hynix Semiconductor Incorporated, Micron Technology Incorporated and Intel Corporation, impressively outperformed the competition, according to a preliminary ranking from iSuppli Corporation.