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Wednesday 18th July 2007
Keithley Instruments, Inc. has announced that it has entered into a Joint Development Partnership (JDP) surrounding semiconductor device material testing technology with CEA Leti.
Wednesday 18th July 2007
Silterra Malaysia has reviewed its new growth plan following the recent announcement of its 90nm and 65nm technology development plan with IMEC. The expansion plan is staged in three phases to accelerate the Company to a high rate of growth for the next few years.
Wednesday 18th July 2007
MEMSCAP has announced that it has accepted a Purchase Order for a total amount of US$ 8.500.000, to manufacture a consumer product. This purchase order complements an initial one delivered over the first 2007 quarter for an amount of 0.3 million US dollars. ; ;
Tuesday 17th July 2007
To integrate new materials and processes in its gate structure to make chips faster and more power-efficient thus enabling Moore's Law to continue, Applied Materials, Inc. has unveiled new technologies to help achieve this by way of a new processes for building high-k/metal gate (HK/MG) structures in high volume production.
Tuesday 17th July 2007
The SAFC Hitech business segment within SAFC, a member of the Sigma-Aldrich Group has announced details of its new five-year chemical roadmap for Metalorganic Chemical Vapor Deposition (MOCVD) and Atomic Layer Deposition (ALD) processes on silicon semiconductor substrates.
Tuesday 17th July 2007
CEA/Leti-Minatec and Alcatel Micro Machining Systems have announced their joint collaboration for the development of industrial process capability in DRIE and LTPECVD for 3D interconnect applications.
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Tuesday 17th July 2007
Carl Zeiss SMT Inc. has announced that it has successfully shipped its first ORION Helium ion microscope to the National Institute of Standards and Technology (NIST).
Tuesday 17th July 2007
Metryx has announced that it has received orders from a major research consortium for its Mentor SF3 300 mm tool and Mentor OC23 200 mm tool. During the evaluation phase, the Mentor successfully identified previously undetected process trends, demonstrating the value mass metrology offers to the industry.
Tuesday 17th July 2007
Eco-Snow Systems has formed a joint development program with Belgian nanoelectronics research centre IMEC to develop and study photoresist and particle removal processes using CO2-based cryogenic cleaning systems.
Tuesday 17th July 2007
Advantest Corporation has announced that the Hsinchu District Court (Hsinchu City, Taiwan) granted a preliminary injunction against TechWing, Inc. following a petition filed by Advantest in February, 2006.
Tuesday 17th July 2007
One year after shifting the objective of its lithography program to the 32nm half pitch node, IMEC reports progress on high-index 193nm immersion lithography, double-patterning schemes for 193nm water-based immersion lithography and extreme UV (EUV) lithography.
Tuesday 17th July 2007
Total semiconductor shipments in Greater China—consisting of Mainland China, Hong Kong and Taiwan—totaled $66.3 billion in 2006, up 11.8 percent from $USD59.3 billion in 2005, according to iSuppli Corp.’s Greater China Competitive Landscaping Tool (CLT). ; As predicted last year, semiconductors shipped to China/Hong Kong increased to about $44.8 billion in 2006, up 15.8 percent from $38.6 billion in 2005.
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Monday 16th July 2007
memsstar Technology today announced that it is to enter into a strategic alliance with SAFC Hitech, a business segment within SAFC, a member of the Sigma-Aldrich Group, to supply fully qualified memsstar SPD (Surface Preparation and Deposition) systems with standard precursor chemical materials from SAFC Hitech for Surface Coatings on micro devices.
Monday 16th July 2007
EV Group (EVG) and Brewer Science, Inc. have announce that they have introduced a new system and offer new capabilities and yield performance for UltraThin Wafer Processing.
Monday 16th July 2007
In the second quarter of 2007, the SEZ Group achieved preliminary net sales of 104.8 million Swiss Francs (CHF), slightly above expectations, and surpassed its sales target for the first six months with CHF 207.4 million.
Monday 16th July 2007
Asyst Technologies, Inc. has announced that its next-generation Velocity HTC (High-Throughput Conveyor) automation system has been selected by a large Japanese memory manufacturer for installation at its newest fab.
Monday 16th July 2007
Vistec Semiconductor Systems received multiple orders for its LDS3300 C macro inspection system from a leading logic manufacturer. The customer will use the systems in a 300 mm wafer fab for inspection and review of wafers in 65 nm production.
Monday 16th July 2007
FormFactor, Inc. has announced that it has developed a breakthrough probing contact technology capable of full area wafer probing of high pin density, ultra fine pitch devices.
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Monday 16th July 2007
Aviza Technology, Inc. has announced it has shipped its Omega fxP deep silicon (DSi) etch system to STMicroelectronics.
Friday 13th July 2007
Cadence Design Systems, Inc. has announced that it has acquired Invarium, Inc.
Friday 13th July 2007
ATDF and UMC have agreed to extend their existing collaboration to evaluate emerging technology products and bring those that are most promising to market.
Friday 13th July 2007
VESTA Technology, Inc has joined with ATDF to unveil Super High-k (Super-k) film, a new product suitable for semiconductor manufacturing in 200 mm and 300 mm wafer fabs.
Friday 13th July 2007
Cirrus Logic Inc. has announced that it has signed a definitive agreement to acquire Apex Microtechnology.
Thursday 12th July 2007
Analogue Devices, Inc. and Taiwan Semiconductor Manufacturing Company have announced a significant accomplishment in their longstanding relationship.

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