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Tuesday 28th August 2007
The Advanced Technologies and Ventures Business for Dow Corning Corporation has been awarded a U.S. patent on a new method for making low dielectric constant (low-k) silicon carbide (SiC) and hydrogenated silicon oxycarbide (H:SiOC) thin films.
Tuesday 28th August 2007
REC has entered into an agreement to build and own a 2.5 MW solar power plant in South Korea.
Friday 24th August 2007
Applied Materials, Inc. has announced that it has completed the acquisition of HCT Shaping Systems (HCT).
Thursday 23rd August 2007
Eyelit, Inc. has announced that a Photovoltaic (PV) Solar Cell producer has selected Eyelit's Enterprise Manufacturing Execution Suite to support manufacturing of Copper Indium Gallium Selenide (CIGS) Solar Panel Production.
Thursday 23rd August 2007
The Forschungszentrum Karlsruhe, R&D centre has started running its new Electron Beam Lithography system (EBL), Vistec VB6.
Wednesday 22nd August 2007
To support its embedded technology customers, Intel Corporation has announced plans to extend its embedded NOR flash products to the 65-nanometer (nm) generation.
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Wednesday 22nd August 2007
In the recent 7 years of semiconductor manufacturing the industry went through a significant technology node. An increase in size of the silicon wafer, to 300 mm, was adopted to increment productivity.
Wednesday 22nd August 2007
German engineering conglomerate Siemens has said that its Power Transmission & Distribution unit plans to create a joint venture with Infineon Technologies for the development and production of power semi-conductors.
Wednesday 22nd August 2007
Point 35 Microstructures has announced the sale of its Parabilis semiconductor spares business to RTS Spares.
Tuesday 21st August 2007
Qimonda and Semiconductor Manufacturing International Corporation (SMIC) have announced that they have signed an agreement to expand their existing cooperation on the production of standard memory chips (DRAMs).
Tuesday 21st August 2007
Lam Research Corporation has announced it has shipped its first 300 mm 2300 Syndion etch system, designed for 3-D IC through-silicon via (TSV) etch applications.
Tuesday 21st August 2007
Infineon Technologies has announced that the company will further strengthen its activities in the field of communications by acquiring the mobility products business of LSI Corporation (LSI), the deal is expected to be closed in the fourth calendar quarter of 2007.
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Tuesday 21st August 2007
Texas Instruments (TI) has announced that it has opened a new Customer Support Centre and representative office in Prague (Czech Republic), adding to existing recently established offices in Warsaw, Moscow and Istanbul and providing new levels of support to Eastern European markets by extending its local customer service.
Tuesday 21st August 2007
Qimonda and Semiconductor Manufacturing International Corporation (SMIC) have announced that they have signed an agreement to expand their existing cooperation on the production of standard memory chips (DRAMs).
Tuesday 21st August 2007
ABI Research forecasts for the global RF power amplifier market indicate that while the total available market for these essential cellular base-station equipment items is still shrinking, the decline is not as severe as had been feared.
Tuesday 21st August 2007
Taiwan Semiconductor Manufacturing Company has announced that it has qualified its 0.13-micron embedded flash process and has entered production.
Monday 20th August 2007
HelioVolt Corporation has announced it has closed $77 million in Series B financing. Funds will be used to build HelioVolt Corporation's first factory and bring Copper Indium Gallium Selenide (CIGS) thin film enabled solar products to market.
Thursday 16th August 2007
Mobile phone penetration continues to rise in developing countries such as India and China.
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Thursday 16th August 2007
Rohm and Haas Company and SKC, Incorporated, have announced the formation of a joint venture that will develop, manufacture and market advanced optical and functional films used in the flat panel display industry.
Thursday 16th August 2007
Rudolph Technologies, Inc. has announced its NSX 115 automated macro defect inspection tool has been selected by a major European fab.
Wednesday 15th August 2007
Semefab has operated its semiconductor Wafer Fab 1 in Scotland, UK for over twenty one years fabricating CMOS, ASIC and Discrete process technologies.
Tuesday 14th August 2007
Hynix Semiconductor is reaping the benefits of improved safety and productivity at 300mm fabs in China and South Korea, thanks to on-site fluorine generation from Linde.
Tuesday 14th August 2007
METEK, Inc. has announced that it has acquired CAMECA.
Tuesday 14th August 2007
Advanced Photonix, Inc. has announced that Shenzhen University, China has entered into a contract to purchase a Picometrix T-Ray 2000 to be used for investigations into the applications of terahertz technology.

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